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Radiation curable and thermosettable resin composition, and dry film solder resist

A thermosetting resin and resin composition technology, applied in the field of DFSR, light-curing and thermosetting resin composition and solder mask dry film, can solve the problem that solder resist does not show, can not meet PCT tolerance, TCT heat resistance HAST resistance, high glass transition temperature and other issues, to achieve the effect of superior PCT resistance, improved heat resistance reliability, high glass transition temperature

Active Publication Date: 2015-01-21
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the solder resist formed from the resin composition does not show a high glass transition temperature or sufficient heat-resistant reliability
Therefore, it has a disadvantage in that it cannot satisfy PCT resistance, TCT heat resistance, HAST resistance to fine wiring, etc., which are required for packaging board materials for semiconductor devices

Method used

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  • Radiation curable and thermosettable resin composition, and dry film solder resist
  • Radiation curable and thermosettable resin composition, and dry film solder resist
  • Radiation curable and thermosettable resin composition, and dry film solder resist

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0168] By combining the cyanate group of the bisphenol cyanate compound BA-230 available from Lonza Co., Ltd. with acrylic acid and 1,2,3,6-tetrahydrophthalic acid (4-cyclohexene -1,2-dicarboxylic acid) was reacted at a molar ratio of 1:1 to obtain an iminocarbonate compound as an acid-modified oligomer.

[0169] 10% by weight of the above iminocarbonate compounds, 25% by weight of ZAR-2000 (Nippon Kayaku Co., Ltd.) were mixed as other acid-modified oligomers, and 5% by weight of DPHA (SK Cytec Co., Ltd.) .) As a photopolymerizable monomer, 2% by weight of TPO as a photoinitiator, 15% by weight of YDCN-500-80P (Nippon Kayaku Co., Ltd.) as a thermosetting adhesive, 0.4% by weight of 2-PI As a thermosetting binder catalyst, 23% by weight of filler BaSO4, 0.3% by weight of pigment phthalocyanine blue, 0.3% by weight of additive BYK-110 and 19% by weight of solvent DMF, a resin composition was prepared.

[0170] A dry film consisting of a carrier film, a photosensitive film (thickness...

Embodiment 2 and 3

[0173] The dry film and the printed circuit board were prepared according to the same steps as in Example 1, except that 5 wt% (Example 2) or 15 wt% (Example 3) of iminocarbonate compounds were used, and according to The amount of amino carbonate compounds increases or decreases the amount of solution.

Embodiment 4 to 6

[0175] The dry film and the printed circuit board were prepared according to the same steps as in Example 1, except that 5% by weight of T-1420 (Nippon Kayaku Co., Ltd.; Example 4), DPCA-60 (Nippon Kayaku Co., Ltd.; Example 5) or R-684 (Nippon Kayaku Co., Ltd.; Example 6) was used as a photopolymerization monomer instead of 5 wt% of DPHA (SK Cytec Co., Ltd.).

[0176] The specific compositions of the resin compositions of Examples 1 to 6 are summarized in Table 1 below.

[0177] [Table 1]

[0178]

[0179]

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Abstract

The present invention relates to a photo-curable and thermo-curable resin composition that can provide a dry film solder resist having a higher glass transition temperature and improved heat resistance reliability, and the dry film solder resist. Said resin composition may include an acid-modified oligomer including an iminocarbonate-based compound having a carboxy group (—COOH) and a photo-curable unsaturated functional group, a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups, a thermo-curable binder having a thermo-curable functional group, and a photo-initiator.

Description

Technical field [0001] The present invention relates to photo-curable and heat-curable resin compositions and solder resist dry films (hereinafter referred to as "DFSR"). More specifically, the present invention relates to a photocurable and thermosetting resin composition that can provide a DFSR having a lower coefficient of thermal expansion (CTE) and improved heat resistance reliability, and to the DFSR. Background technique [0002] Since various electronic devices are miniaturized and lighter in weight, photosensitive solder resists that can form extremely small opening patterns are used in printed circuit boards, semiconductor packaging boards, flexible circuit boards, and the like. [0003] The semiconductor package product is a complex material, which is composed of non-conductors such as epoxy molding or solder resist, semiconductors such as chips and conductors such as board circuit patterns. In order to prepare the semiconductor package products, various processes are re...

Claims

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Application Information

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IPC IPC(8): C08L101/02G03F7/004G03F7/028C08L69/00C08F283/02
CPCC08G73/0644C08G73/0655C09D179/04C08G73/065C08L63/00G03F7/029G03F7/032
Inventor 具世真崔炳株郑遇载崔宝允李光珠郑珉寿
Owner LG CHEM LTD