Resin composition for electromagnetic wave absorbing material

A technology of resin composition and wave absorbing material, applied in the application of resin composition for electromagnetic wave absorbing material, composite material and wave absorbing circuit, prepreg, preparation of bonding sheet, can solve the problem that the substrate is easy to absorb water and damp , Low curing crosslinking density, low heat resistance and other problems

Active Publication Date: 2020-11-10
KUANG CHI CUTTING EDGE TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, E-51, E-44, E-42, E-20, E-12 and other epoxies are difunctional bisphenol A resins, which have low curing crosslinking density, low glass transition temperature of the cured substrate, and heat-resistant Low sex
Moreover, dicyandiamide micro-powder molecules have strong polarity, and the substrate after curing is easy to absorb water and get damp, resulting in poor heat resistance and chemical resistance of the substrate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0129] The preparation method of the present invention comprises:

[0130] (1) mixing the components of the resin composition for electromagnetic wave absorbing material of the present invention; and

[0131] (2) impregnating the reinforcing fiber into the mixture obtained in step (1) to obtain an intermediate product, the intermediate product comprising a bonding sheet, a prepreg or a prepreg.

[0132] In a specific embodiment, the preparation method of the resin product for electromagnetic wave absorbing material of the present invention further includes:

[0133] (3) Laminating the intermediate product to prepare a composite material, or laminating the intermediate product and copper foil to obtain a wave-absorbing circuit substrate.

[0134] Step (1) also includes mixing the components, melting the resin, curing agent and accelerator etc. into a liquid state, and stirring evenly.

[0135] In a particular embodiment, the mixture is melted at a temperature of 50±10°C, pref...

Embodiment 1

[0155] Take by weighing 130 parts by weight of liquid multifunctional epoxy resin (U.S. Dow DEN438), the liquid bisphenol epoxy resin (Baling Petrochemical CYD-128) of 15 parts by weight, the aromatic amine (m-phenylenediamine) of 50 parts by weight, 200 parts by weight of carbonyl iron powder and 0.01 parts by weight of 2-methylimidazole (2-MI) were added to the beaker, and then the beaker was placed in an oven and heated at 50°C for two hours, then stirred until uniform and ready for use.

[0156] Use 8 sheets (200mm*200mm) of aramid fiber cloth to immerse in the above resin combination liquid for impregnation. Bake in an oven at 80°C / 2 minutes + 130°C / 3 minutes + 175°C / 5 minutes to make a semi-cured adhesive sheet.

[0157] Superimpose and align the above 8 adhesive sheets, with a 35um copper foil on the top and bottom. In the vacuum press, according to the temperature of 210 ℃, the pressure of 30kgf / cm 2 Conditions, pressed for 180 minutes, made of double-sided copper-cl...

Embodiment 2

[0159] Take by weighing 130 parts by weight of liquid multifunctional epoxy resin (U.S. Dow DEN438), the liquid bisphenol epoxy resin (Baling Petrochemical CYD-128) of 15 parts by weight, the aromatic amine (m-phenylenediamine) of 50 parts by weight, 250 parts by weight of carbonyl iron powder and 0.05 parts by weight of 2-methylimidazole (2-MI) were added into a beaker, and then the beaker was placed in an oven and heated at 50°C for two hours, then stirred until uniform and ready for use.

[0160] Use 8 sheets (200mm*200mm) of aramid fiber cloth to immerse in the above resin combination liquid for impregnation. Bake in an oven at 80°C / 2 minutes + 130°C / 3 minutes + 175°C / 5 minutes to make a semi-cured adhesive sheet.

[0161] Superimpose and align the above 8 adhesive sheets, with a 35um copper foil on the top and bottom. In the vacuum press, according to the temperature of 210 ℃, the pressure of 30kgf / cm 2 Conditions, pressed for 180 minutes, made of double-sided copper-cl...

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Abstract

The invention relates to a resin composition for an electromagnetic wave absorbing material. The composition is prepared from resins includingliquidmultifunctional-group epoxy resin and liquid bifunctional-group epoxy resin with the number-average molecular weight of 2000-4000, an aromatic diamine curing agent with a symmetrical structure, an absorbing agent and an accelerator, wherein the dosage ratio of theliquidmultifunctional-group epoxy resin to theliquid bifunctional-group epoxy resin to the curing agent to the absorbing agent to the accelerator is 130 / - 20 parts to 15 + / - 8 parts, 50 + / - 10 parts, 200-250 parts to 0.01-0.05 part by weight. The invention further relates to a preparation method of the composition, a productprepared by the composition and application of the composition. Thecomposition or the product can not only meet the wave absorbing performance requirements, but alsois resistant to high temperature, has good ageing resistance performance, low water absorption rate and high mechanical strength.

Description

technical field [0001] The invention relates to the field of composite materials and absorbing circuits, in particular to a resin composition for electromagnetic wave absorbing materials and its application in the preparation of adhesive sheets, prepregs, composite materials and absorbing circuits. Background technique [0002] In the prior art, E-51, E-44, E-42, E-20, E-12 and other epoxy resins are usually used as matrix resins, and dicyandiamide micropowder is used as curing agent to prepare electromagnetic wave absorbing materials. However, E-51, E-44, E-42, E-20, E-12 and other epoxies are difunctional bisphenol A resins, which have low curing cross-linking density, low glass transition temperature of the cured substrate, and heat-resistant Sex is low. Moreover, dicyandiamide micro-powder molecules have strong polarity, and the substrate after curing is easy to absorb water and get damp, resulting in poor heat resistance and chemical resistance of the substrate. [00...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/18C08G59/50B32B27/04B32B27/06B32B27/38
Inventor 不公告发明人
Owner KUANG CHI CUTTING EDGE TECH LTD
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