A substrate glass platinum channel structure and its preparation method and filler for the substrate glass platinum channel structure

A platinum channel and filler technology, applied in the direction of the feed tank, etc., can solve the problems affecting the uniformity of the temperature distribution of the platinum channel, affecting the quality of the substrate glass, and the condensation of platinum particles, etc., to facilitate large-scale production, prolong life, and improve use. performance effect

Active Publication Date: 2017-04-26
IRICO DISPLAY DEVICES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In addition, in the production of TFT-LCD substrate glass, it is hoped that the temperature distribution inside the platinum channel is relatively uniform, and there is no low temperature point, because the condensation of platinum particles is very easy to occur at low temperature points, thereby affecting the quality of the substrate glass
In the past, the fillers used were aluminum oxide powder solution or aluminum oxide hollow sphere solution, which are prone to precipitation effect. After sintering, the top is loose and the bottom is dense, which affects the uniformity of the temperature distribution of the platinum channel.
If water is not added to these two fillers, and only alumina powder or alumina hollow balls are used, the sintering temperature will be too low or sintering will not be possible.

Method used

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  • A substrate glass platinum channel structure and its preparation method and filler for the substrate glass platinum channel structure

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preparation example Construction

[0031] A method for preparing a substrate glass platinum channel structure, comprising the following steps:

[0032] 1) ZrO with a mass percentage of 70% to 85% 2 , 5% to 20% Al 2 o 3 and 1 to 10% SiO 2 Mix by physical stirring at room temperature to control Fe in impurities 2 o 3 The percentage of the mass of the filler is less than 0.5%, that is, the filler is obtained;

[0033] 2) Make the upper and lower layers of refractory materials, and open grooves on the lower layer of refractory materials that can place platinum channels. The depth and width of the grooves are larger than the diameter of the platinum channel, and the refractoriness of the used refractory materials is greater than 1700 ° C;

[0034] 3) Place the platinum channel in the groove of the lower refractory material, and leave a gap of 5-50mm between the wall of the platinum channel and the wall of the groove, fix the platinum channel, and clean the outer surface of the platinum channel in contact with t...

Embodiment 1

[0043] 1) get the ZrO that mass percent is 70% 2 , 20% Al 2 o 3 and 10% SiO 2 , to control the Fe in the impurity 2 o 3 The percentage of the mass of the filler is 0.5%, and the filler is mixed by physical stirring at room temperature to obtain a filler with a sintering temperature between 1100°C and 1300°C;

[0044] 2) Make the upper and lower layers of refractory materials, and open grooves on the lower layer of refractory materials that can place platinum channels. The depth and width of the grooves are greater than the diameter of the platinum channel, and the refractoriness of the used refractory materials is greater than 1700 ° C;

[0045] 3) Place the platinum channel in the groove of the lower refractory material, and leave a gap of 5-50mm between the wall of the platinum channel and the wall of the groove, fix the platinum channel, and clean the outer surface of the platinum channel contacting the filler with ethanol After the purification treatment, fill the fil...

Embodiment 2

[0048] First take the ZrO with a mass percentage of 75% 2 , 15% Al 2 o 3 and 10% SiO 2 , to control the Fe in the impurity 2 o 3 The percentage of the mass of the filler is less than 0.5%, and the filler is mixed by physical stirring at room temperature to obtain a filler with a sintering temperature between 1100°C and 1300°C; then the refractory material is made, and the platinum channel is placed in the lower layer of refractory material; finally The gap between the platinum channel and the refractory material is filled with the filling material, and the upper layer of refractory material is covered to obtain the substrate glass platinum channel structure.

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Abstract

The invention discloses a substrate glass platinum channel structure and a preparation method thereof, and a filler for the substrate glass platinum channel structure, and aims to protect the platinum channel by using the ZrO2-based filler, thereby prolonging the service life of the platinum channel. The technical scheme is as follows: the substrate glass platinum channel structure comprises a platinum channel, and an upper-layer refractory material and a lower-layer refractory material which are coated on the periphery of the platinum channel, wherein the lower-layer refractory material is provided with a groove for placing the platinum channel, and the depth and width of the groove are respectively greater than the diameter of the platinum channel; the refractory materials are used for supporting and soaking the platinum channel; the fire resistance of the refractory materials is greater than 1700 DEG C; a clearance respectively is left between the platinum channel and the upper and lower refractory materials, and filled with a filler; the filler comprises the following components in percentage by mass: 70-85% of ZrO2, 5-20% of Al2O3 and 1-10% of SiO2; and the sintering temperature of the filler is 1100-1300 DEG C.

Description

technical field [0001] The invention relates to the field of glass substrate production, in particular to a substrate glass platinum channel structure, a preparation method thereof and a filling material for the substrate glass platinum channel structure. Background technique [0002] In the production of TFT-LCD substrate glass, a platinum channel is used as a glass delivery device. During the heating process of the platinum channel, the platinum will expand and its strength will decrease. If it comes into direct contact with the refractory material, the platinum channel will be damaged. [0003] Therefore, it is necessary to leave a certain gap between the platinum channel and the refractory material, and then add fillers to play the role of buffer protection. Since platinum expands faster below 1100°C, and expands less when it is above 1100°C, it is hoped that the filler will not sinter below 1100°C, so as not to hinder the expansion of platinum, and it will be in a sinte...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03B7/02C04B35/66
Inventor 孙钢智黄鲲
Owner IRICO DISPLAY DEVICES
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