Silicon-containing bismaleimide resin and preparation thereof

A technology of bismaleimide resin and bismaleimide, which is applied in the field of high-performance polymer material manufacturing and can solve problems such as complicated synthesis steps

Inactive Publication Date: 2015-01-28
SHANGHAI INST OF ORGANIC CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such modification requires tedious synthetic steps

Method used

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  • Silicon-containing bismaleimide resin and preparation thereof
  • Silicon-containing bismaleimide resin and preparation thereof
  • Silicon-containing bismaleimide resin and preparation thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0148] A kind of preparation method of modified bismaleimide resin, described method comprises steps:

[0149] Copolymerize with allyl substituted aryl siloxane such as formula I and bismaleimide such as formula II to obtain modified bismaleimide resin:

[0150]

[0151] In the formula, n≥2, preferably, n=10~20;

[0152] R 1 Selected from the group consisting of substituted or unsubstituted C1-C30 alkyl, substituted or unsubstituted C1-C30 aryl, substituted or unsubstituted C2-C30 aryl-alkyl, substituted or unsubstituted C3 -C30 aryl-alkyl-aryl, substituted or unsubstituted C3-C30 aryl-carbonyl-aryl, substituted or unsubstituted C2-C30 aryl-oxy-aryl, substituted or unsubstituted C2-C30 aryl-oxygen-aryl-oxygen-aryl, substituted or unsubstituted C2-C30 aryl-sulfur-aryl, substituted or unsubstituted C2-C30 aryl-sulfone- Aryl;

[0153] Wherein, the substitution refers to being substituted by one or more groups selected from the group consisting of halogen, C1-C4 alkyl, C1-C...

Embodiment 1

[0171] The synthesis of embodiment 1 p-bromoallyl phenyl ether

[0172]

[0173] Under argon protection, add 51.9 grams of 4-bromophenol (0.3mol), 60.5 grams of allyl bromide (0.5mol) and 300 milliliters of DMSO (dimethyl sulfoxide) steamed now in the reaction apparatus, stir at room temperature for 30 Add 53 grams of anhydrous sodium carbonate (0.5mol) after 10 minutes, react at room temperature for 10 hours, pour the reaction mixture solution into water, stir vigorously for 20 minutes, extract the product in batches with chloroform, and extract the solution with saturated sodium chloride aqueous solution After washing, the chloroform was removed by rotary evaporation, and the obtained solid was washed with water and a small amount of ethanol to obtain 100 g of the product with a yield of 94%. Hydrogen spectrum characterization ( 1 H NMR, 300MHz, CDCl 3 ) 7.55 (d, 2H), 7.02 (d, 2H), 5.94 (d, 1H), 5.33 (d, 1H), 5.22 (d, 1H), 4.66 (s, 2H).

Embodiment 2

[0174] The synthesis of embodiment 2 p-bromoallyl phenyl ethers

[0175]

[0176] Under argon protection, add 51.9 grams of 4-bromophenol (0.3mol), 38 grams of allyl chloride (0.5mol) and 300 milliliters of DMSO (dimethyl sulfoxide) steamed now in the reaction apparatus, stir at room temperature for 30 Add 53 grams of anhydrous sodium carbonate (0.5mol) after 10 minutes, react at room temperature after 10 hours, pour the reaction mixed solution into water, stir vigorously for 20 minutes, the product is extracted with chloroform in batches, and the extract is saturated sodium chloride aqueous solution After washing, the chloroform was removed by rotary evaporation, and the obtained solid was washed with water and a small amount of ethanol to obtain 88 g of the product, with a yield of 83%. Hydrogen spectrum characterization ( 1 H NMR, 300MHz, CDCl 3 ) 7.55 (d, 2H), 7.02 (d, 2H), 5.94 (d, 1H), 5.33 (d, 1H), 5.22 (d, 1H), 4.66 (s, 2H).

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Abstract

The invention belongs to the field of high-performance polymer synthesis and application, and in particular relates to a method for preparing silicon-containing bismaleimide resin. The modified silicon-containing bismaleimide resin is prepared by copolymerizing a bismaleimide monomer with allylic organic silicon resin. Compared with pure bismaleimide resin, the modified silicon-containing bismaleimide resin is high in thermal resistance in addition to relatively low dielectric constant. The modified resin can be used as a high-temperature resisting adhesive as well as a packaging material and laminated substrate resin of electronic devices in the electric industry.

Description

technical field [0001] The invention belongs to the field of manufacturing high-performance polymer materials, and in particular relates to a method for manufacturing silicon-containing bismaleimide resin. Background technique [0002] Among the existing thermosetting resins, aromatic bismaleimide can self-polymerize when heated, does not emit small molecule volatiles, and the polymerization product has a higher heat-resistant temperature and better electrical insulation properties , and is considered to be a variety with relatively high performance and price. However, the material formed by the self-polymerization of pure bismaleimide is relatively brittle, so it must be toughened and modified. At present, the more successful modification method is to modify bismaleimide resin with diallyl bisphenol A and bismaleimide resin with binary aromatic amine. That is to extend the chain of pure resin, thereby reducing the cross-linking density of the resin. Compared with the pur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/12C08F222/40C08G77/14
Inventor 房强朱芝田
Owner SHANGHAI INST OF ORGANIC CHEM CHINESE ACAD OF SCI
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