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A kind of magnetothermal curing method of thermosetting resin adhesive

A curing method and thermosetting technology, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems of low equipment investment, heat affected zone, etc., achieve short curing time, improve crosslinking density, curing uniformity and full effect

Inactive Publication Date: 2016-07-06
SHENYANG LIGONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention overcomes the defects in the prior art, solves the practical problem of "heat-affected zone" when the resin structural adhesive is thermally cured, and provides a fast, low-cost, high-strength, high-toughness magnetothermal curing method; it has Low curing temperature, less equipment investment, convenient operation and good bonding effect

Method used

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  • A kind of magnetothermal curing method of thermosetting resin adhesive
  • A kind of magnetothermal curing method of thermosetting resin adhesive
  • A kind of magnetothermal curing method of thermosetting resin adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Embodiment 1 gets 1.81g through the nano-Ni of silane coupling agent KH-550 surface modification 0.5 Zn 0.5 Fe 2 o 4 Add the powder into 12.51g of epoxy resin E-44, stir well and ultrasonically disperse, then add 0.63g of polyamide and aliphatic amine blend curing agent into the epoxy resin, and mix well. The above mixed solution was poured into a mold, and the mold was placed in an alternating magnetic field with a magnetic field strength of 22.7kA / m, an alternating heating current of 275A, and a magnetic field frequency of 250kHz at room temperature for magnetothermal curing.

Embodiment 2

[0025] Embodiment 2 gets 1.49g through the nano-Ni of silane coupling agent KH-550 surface modification 0.5 Zn 0.5 Fe 2 o 4 Add the powder into 15.48g of epoxy resin E-44, stir well and ultrasonically disperse, then add 0.77g of polyamide and aliphatic amine blend curing agent into the epoxy resin, and mix well. The above mixed solution was poured into a mold, and the mold was placed in an alternating magnetic field with a magnetic field strength of 22.7kA / m, an alternating heating current of 275A, and a magnetic field frequency of 250kHz at room temperature for magnetothermal curing.

Embodiment 3

[0026] Embodiment 3 gets 1.08g through the nano-Ni of silane coupling agent KH-550 surface modification 0.5 Zn 0.5 Fe 2 o 4 Add the powder into 11.18g of epoxy resin E-44, stir well and ultrasonically disperse, then add 0.56g of polyamide and aliphatic amine blend curing agent into the epoxy resin, and mix well. The above mixed solution was poured into a mold, and the mold was placed in an alternating magnetic field with a magnetic field strength of 18.9kA / m, an alternating heating current of 230A, and a magnetic field frequency of 250kHz at room temperature for magnetothermal curing.

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Abstract

The invention relates to a magneto-calorific curing method for a thermosetting resin adhesive, and the magneto-calorific curing method for the thermosetting resin adhesive is a novel curing method and has the advantages of low temperature, low cost, quickness, high intensity and high toughness. The magneto-calorific curing method is based on magnetic particles and has the characteristic of magnetothermal effect, nanometer magnetic ferrite is evenly dispersed into the thermosetting resin adhesive, during the use, an alternating magnetic field is exerted onto the adhesive, during the magnetic pulsing process of the magnetic ferrite, the energy of the magnetic field is absorbed extensively through magnetic hysteresis loss, eddy loss, residual loss and the like, the magnetic energy is converted into heat energy, and heat produced by nanometer ferrite particles quickly extend to the periphery in a radiating way, therefore, resin adjacent molecules are prompted to be in quick and even curing reaction.

Description

technical field [0001] The invention belongs to the field of functional materials and relates to a low-temperature, low-cost, fast, high-strength, high-toughness thermosetting resin adhesive magnetothermal curing method. Background technique [0002] For construction adhesives used in winter construction, heating and curing is not desired or allowed or even impossible in many occasions, such as repair, reinforcement and reinforcement of civil construction, bridges and dams, which often need to be carried out at low temperature (below 5°C) Therefore, there is an urgent demand on the market to develop low-temperature, fast and efficient curing resin adhesives. Aiming at the problem of resin curing at low temperature, people focus on the development of low-temperature curing agents or research on the synthesis and modification of low-temperature resins, but there are generally problems such as long curing time, poor curing performance, toxicity, high viscosity, and high volatil...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C08G59/56C08K9/06C08K3/22
Inventor 赵海涛李成吾刘瑞萍王俏马瑞廷李喜坤
Owner SHENYANG LIGONG UNIV