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Light-emitting device

A light-emitting device and light-emitting element technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of reduced flatness of the mounting surface of the mounting substrate, poor mounting, and increased manufacturing costs, and achieves increased bonding strength and high flatness , to prevent the effect of poor installation

Inactive Publication Date: 2015-02-11
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the mounting substrate is made of ceramics like the light-emitting device 201, the flatness of the mounting surface of the mounting substrate is low, and mounting defects are likely to occur.
In particular, in the case where heat dissipation vias of the heat conductor portion 215 are provided as in the light emitting device 201, the flatness of the mounting surface of the mounting substrate is further reduced.
In addition, in the case where an ESD protection element is provided on the side surface on which the light-emitting element of the mounting substrate is mounted as in the light-emitting device 301, the flatness of the mounting surface of the mounting substrate is also low, so that mounting defects are likely to occur.
In order to improve the flatness of the mounting surface of the mounting substrate, although the mounting surface of the mounting substrate can be flattened by chemical mechanical polishing, etc., there are problems such as the complexity of the manufacturing process and the increase of the manufacturing cost.

Method used

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Embodiment Construction

[0039] Hereinafter, the light emitting device according to the first embodiment of the present invention will be described.

[0040] figure 1 It is an equivalent circuit diagram of the light emitting device 10 according to the first embodiment of the present invention.

[0041] A light emitting device 10 according to the present embodiment includes an LED element 2 as a light emitting element and a mounting substrate 11 . Mounting substrate 11 incorporates Zener diode 3 . The LED element 2 is mounted on the mounting substrate 11 and connected in parallel to the Zener diode 3 . Here, the cathode of the LED element 2 is connected to the anode of the Zener diode 3 , and the anode of the LED element 2 is connected to the cathode of the Zener diode 3 . Zener diode 3 protects LED element 2 from electrostatic influence. That is, the Zener diode 3 is a semiconductor electrostatic discharge protection element part.

[0042] figure 2 It is a schematic diagram explaining the stru...

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Abstract

The present invention is capable of preventing a reduction in the light-emission efficiency of a light-emitting element, and preventing the occurrence of incorrect mounting of a light-emitting element, by using a configuration for integrating an ESD protection element into a mounting substrate. A light-emitting device (10) is equipped with: a light-emitting element (2); and a mounting substrate (11) which has a first surface (11A) on which the light-emitting element (2) is mounted, and a second surface (11B) facing the first surface (11A), and is equipped with a semiconductor-electrostatic-discharge protection element unit (15) connected to the light-emitting element (2) and positioned on the second-surface (11B) side.

Description

technical field [0001] The present invention relates to a light emitting device including a light emitting element and a mounting substrate on which the light emitting element is mounted. Background technique [0002] In recent years, lighting devices using semiconductor light emitting diode (LED: Light Emitting Diode) devices, which are light emitting devices that consume less power and have a long life, are becoming widespread. An LED device used in a lighting device or the like includes an LED element as a light emitting element and a mounting substrate on which the LED element is mounted. The mounting substrate is made of ceramics such as alumina. The LED device described above is mounted on a circuit board constituting a lighting device. [0003] A conventional LED device includes an electrostatic discharge (ESD: Electro Static Discharge hereinafter) protection element for protecting the LED element from static electricity in order to prevent the LED element from bein...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48
CPCH01L33/486H01L25/167H01L2224/48091H01L2924/00014H01L2924/181H01L2224/16145H01L2224/73265H01L2924/00012H01L27/15H01L33/483
Inventor 福光政和佐佐木秀彦山本悌二
Owner MURATA MFG CO LTD