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Metallic surrounding back contact battery and production method and packaging method thereof

A back-contact battery, metal surround technology, applied in the field of solar cells, can solve the problem of high process cost, avoid welding short circuit, facilitate industrialization, and simplify operation.

Inactive Publication Date: 2015-02-18
TIANWEI NEW ENERGY HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a metal surround back contact battery, and provide a preparation method and a packaging method for the battery, so as to solve the problem that the current metal surround back contact battery can only be packaged with a conductive copper foil integrated back plate, resulting in high process costs The problem

Method used

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  • Metallic surrounding back contact battery and production method and packaging method thereof
  • Metallic surrounding back contact battery and production method and packaging method thereof
  • Metallic surrounding back contact battery and production method and packaging method thereof

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Embodiment

[0042] Such as figure 1 , figure 2 As shown, a metal surround back contact battery described in this embodiment includes a silicon wafer, a number of holes are arranged on the silicon wafer, the holes are filled with silver paste, a heavily doped layer is provided on the front side of the silicon wafer, and a silicon wafer is provided with a heavily doped layer. There is a silver electrode and an aluminum back field on the back, and a heavily doped layer is also set between the silver electrode and the back of the silicon wafer. The silver electrode includes a front electrode and a back electrode, and the front electrode is connected to the silver paste in the hole. The electrodes are strip electrodes and parallel to each other.

[0043] This embodiment starts from the battery structure itself, by setting a heavily doped layer between the silver electrode and the back of the silicon wafer, that is, the silver electrode is not in contact with the back of the silicon wafer. Un...

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PUM

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Abstract

The invention discloses a metallic surrounding back contact battery and a production method and a packaging method thereof. The metallic surrounding back contact battery comprises a silicon chip, a plurality of holes are arranged in the silicon chip and filled with silver paste, the front of the silicon chip is provided with a heavily-doped layer, the back of the silicon chip is provided with a silver electrode and aluminum back fields, a heavily-doped layer is arranged between the silver electrode and the back of the silicon chip as well, the silver electrode comprises a front electrode body and a back electrode body, the front electrode body is connected with the silver paste in the holes, and both the front electrode body and the back electrode body are strip electrodes and parallel to each other. Electric leakage of the battery can be reduced, short circuit during welding can be avoided during post-packaging of the battery, procedures are decreased, packaging cost is saved, and industrialization is facilitated.

Description

technical field [0001] The invention relates to the field of solar cells, in particular to a structure of a metal-surrounded back contact cell, a preparation method and a packaging method of the cell. Background technique [0002] One of the effective ways to improve the conversion efficiency of crystalline silicon solar cells is to reduce the optical loss. Optical loss can be divided into solar cell front reflection loss, solar cell front shading loss and light direct penetration solar cell loss. [0003] (1) In view of the frontal reflection loss of solar cells, researchers have developed new technologies such as advanced surface texturing and double-layer anti-reflection coatings. A. Advanced surface texturing: Compared with the common alkali-made pyramid structure and acid-made worm structure, the new surface structure prepared by reactive ion etching, laser etching, metal ion catalytic etching and other technologies can further reduce silicon The reflectivity of the s...

Claims

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Application Information

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IPC IPC(8): H01L31/0224H01L31/18
CPCH01L31/02245H01L31/18Y02P70/50
Inventor 龙巍吴婧蔡蔚林洪峰
Owner TIANWEI NEW ENERGY HLDG