A method for preparing a silicon carbide jfet gate structure with rectification
A gate structure, silicon carbide technology, used in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., to achieve the effect of expanding the working range, avoiding accidental opening, and improving channel conduction performance
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[0020] A method for preparing a silicon carbide JFET gate structure with a rectification function, comprising the following process steps:
[0021] 1) growing a first conductivity type layer 1 on a first conductivity type substrate 2;
[0022] 2) Two parts of the gate contact region 7 and the gate region 6 with the second conductivity type are respectively formed by two sets of implants, and the gate region 6 forms a PN junction with the drift region 1 and the channel region 3 with the first conductivity type;
[0023] 3) realizing ohmic contact between the source electrode 5 and the channel region 3 and between the drain electrode 4 and the substrate 2 of the first conductivity type by ohmic contact annealing;
[0024] 4) A rectifying gate contact is formed between the gate electrode 8 and the gate contact region 7 of the second conductivity type by rectifying gate contact annealing.
[0025] The turn-on voltage of the rectification grid can be controlled at 2V-20V.
[0026...
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