Conductive paste and substrate with conductive film

A conductive and paste technology, applied in the field of substrates with conductive films, can solve the problems of damaged conductivity, high cost, deterioration of conductivity, etc., to achieve suppression of deterioration of conductivity, high conductivity, and excellent conductivity Effect

Active Publication Date: 2017-12-19
UNKNOWN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, the conductive paste described in Patent Document 2 has a problem of high cost due to the complicated process of thinly coating nickel on the surface of metal particles by electroless plating.
As a result, there is oxidized nickel on the surface of the metal particles, and there is a problem that the conductivity is impaired.
In addition, the conductive paste described in Patent Document 3 has a problem that conductivity is deteriorated by 20% compared to the case of only silver particles due to the addition of nickel particles with a large particle size to silver particles with low resistivity to inhibit conduction. ~65% or so

Method used

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  • Conductive paste and substrate with conductive film

Examples

Experimental program
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Effect test

Embodiment

[0076] Hereinafter, the present invention will be described in further detail through examples, but the present invention is not limited to these examples. Examples 1 to 8 are examples, and examples 9 to 13 are comparative examples. In addition, the average particle diameter of metal particles (copper particles) and base metal particles (nickel particles), the thickness of the conductive film, and the electrical resistivity were measured using the apparatus shown below, respectively.

[0077] (The average particle size)

[0078] Copper particles are used as metal particles. The particle size of the copper particles is calculated as follows: the Feret diameter of 100 particles randomly selected from the SEM image obtained by SEM (manufactured by HITACHI HIGH-TECHNOLOGIES CORPORATION, S-4300) is measured, and the Feret diameter of each copper particle When the maximum radial direction is the long axis and the axis perpendicular to the long axis is the short axis, the average value ...

example 1

[0084] After adding 3.0 g of formic acid and 9.0 g of a 50% by mass aqueous hypophosphorous acid solution to a glass beaker, the beaker was placed in a water bath and kept at 40°C. 5.0 g of copper particles (manufactured by Mitsui Metal Mining Co., Ltd., trade name: 1400YP) having an average particle diameter of 6 μm were slowly added to the beaker, and stirred for 30 minutes to obtain a copper dispersion.

[0085] A centrifugal separator was used to perform centrifugal separation at 3000 rpm for 10 minutes, and the precipitate was recovered from the obtained copper dispersion. The precipitate was dispersed in 30 g of distilled water, and the aggregate was precipitated again by centrifugal separation to separate the precipitate. After that, the obtained precipitate was heated at 80° C. for 60 minutes under a reduced pressure of -35 kPa to volatilize the remaining water and gradually remove it, thereby obtaining copper particles (A) whose particle surfaces were surface-modified.

...

example 2

[0089] The copper particles were obtained in the same manner as in Example 1, except that the copper particles were changed to copper particles (manufactured by NIPPON ATOMIZED METALPOWDERS CORPORATION, trade name: AFS-Cu) with an average particle diameter of 7 μm, and nickel powder was changed to an average particle diameter of 0.5 μm. Copper paste. The value of the average particle diameter of the nickel powder (particles) of the component (B) / the average particle diameter of the copper particles of the component (A) is 0.07.

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Abstract

PROBLEM TO BE SOLVED: To provide a conductive paste capable of forming a conductive film having good conductivity and excellent durability, and to provide a substrate with a conductive film formed by using such a conductive paste.SOLUTION: The conductive paste contains (A) metal particles having a volume resistivity of 10 μ&OHgr; cm or less and an average particle diameter of 1-15 μm, (B) base metal particles having an average particle diameter of 0.1-3 μm and an oxidation-reduction potential of -440 to 320 mV (SHE), and (C) a binder resin. The base metal particles as the component (B) are contained in an amount of 0.01-3 pts.mass based on 100 pts.mass of the metal particles as the component (A).

Description

Technical field [0001] The present invention relates to a conductive paste and a substrate with a conductive film using the conductive paste. Background technique [0002] Conventionally, in the formation of wiring conductors such as electronic components and printed wiring boards, a method of using a conductive paste containing metal particles with high conductivity has been known. Among them, the production of a printed wiring board is carried out as follows: a conductive paste is applied to a desired pattern shape on an insulating base material and cured to form a conductive film as a wiring pattern. [0003] The conductive paste used for the above purposes should have the following characteristics: (1) Good conductivity, (2) Easy to perform screen printing, gravure printing, (3) Good adhesion between the coating film and the insulating substrate, (4) Thin-line circuits and the like can be formed. [0004] In order to satisfy the above characteristics, the conductive paste conta...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B5/14
CPCH01B1/22H01B5/14H05K1/092
Inventor 平社英之米田贵重柏田阳平
Owner UNKNOWN
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