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Manufacturing method for lead-free copper-based amorphous brazing filler metal

A lead-free copper-based, brazing material technology, applied in welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problems of alloy brittleness, inability to make tape, low strength and toughness, etc.

Inactive Publication Date: 2015-03-25
刘桂芹
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the existence of P element in the existing copper-based brazing material, the alloy is very brittle, and its strength and toughness are not high, so it cannot be made into strips, which limits its application.

Method used

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Embodiment Construction

[0044] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0045] The lead-free copper-based amorphous solder of the present invention includes P element, Bi element, Sn element, Zn element, Ce element, and Cu element, and the total mass percentage of the lead-free copper-based amorphous solder is 100%, wherein , 0.02%≤P≤0.06%, 0.02%≤Bi≤0.06%, 4.0%≤Sn≤6.8%, 13.5%≤Zn≤14.3%, 0.15%≤Ce≤0.22%, 71%≤Cu≤83%, Yu The amount is impurity. For the harm of P element in existing brazing material, it is impossible to completely eradicate P element. Therefore, the present invention adds Bi element, and Bi element and P element form (Sn-9Zn0.05Ce)xBi and other elements respectively. (Sn-9Zn0.05Ce)...

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Abstract

The invention discloses a manufacturing method for lead-free copper-based amorphous brazing filler metal. The total mass percent of the lead-free copper-based amorphous brazing filler metal is 100%, wherein 0.02%<=P<=0.06%, 0.02%<=Bi<=0.06%, 4.0%<=Sn<=6.8%, 13.5%<=Zn<=14.3%, 0.15%<=Ce<=0.22%, 71%<=Cu<=83%, and the balance is impurities. The manufacturing method includes the steps of material preparing and alloy smelting. The Bi element is specially added, meanwhile, the Cu element is thoroughly removed, the microscopic structure morphology of the lead-free copper-based amorphous brazing filler metal is analyzed, the tensile strength, elongation percentage after fracture and Vickers hardness of the lead-free copper-based amorphous brazing filler metal are tested, and the results show that by adding the Bi element, the tensile strength and hardness of the lead-free copper-based amorphous brazing filler metal can be obviously improved, and the brazing filler metal can be promoted to be precipitated to obtain needle-shaped or particle-shaped zinc-rich phases.

Description

technical field [0001] The invention relates to a preparation method of solder, in particular to a preparation method of lead-free copper-based amorphous solder. Background technique [0002] At present, known brazing materials are mainly divided into three types: silver-based, nickel-based, and copper-based. Silver-based brazing material has high silver content, moderate and stable melting point, excellent permeability and fluidity, good strength and toughness after welding, and excellent thermal and electrical conductivity. It has been widely used in the welding of workpieces with small contact surfaces; and its surface color is light after brazing, which can be applied to the processing of silver jewelry, glasses and other industries. Nickel-based brazing materials are used in the welding of high-temperature alloys and stainless steel parts (such as aviation parts, automobile and ship parts, cooking utensils, medical equipment, etc.). The copper-based brazing material i...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/40
CPCB23K35/302B23K35/40
Inventor 刘桂芹
Owner 刘桂芹
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