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Flip eutectic LED packaging method

A technology of LED packaging and LED chips, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of high product restrictions, unsuitable use, short mold life, etc., to improve production efficiency and quality, and promote the welding process. , the effect of reducing costs

Inactive Publication Date: 2015-03-25
HUIZHOU DAYAWAY EVER BRIGHT ELECTRONICS IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that the product is highly restrictive, and most planar products such as ceramic substrates and aluminum substrates are not suitable for use
And the life of the mold bar is short and the cost is high

Method used

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  • Flip eutectic LED packaging method
  • Flip eutectic LED packaging method
  • Flip eutectic LED packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This embodiment provides a flip-chip eutectic LED packaging method, such as figure 1 shown, including the following steps:

[0039] 01. The suction nozzle sucks the LED chip.

[0040] 02. Heat the suction nozzle to melt the metal solder at the bottom of the LED chip and combine it with the specified position of the eutectic region substrate. The substrate may be a ceramic substrate, a copper substrate, an aluminum substrate, or the like. It is possible, but not limited to, to heat the suction nozzle using pulse heating.

[0041] It may be, but not limited to, after the suction nozzle picks up the LED chip and before combining it with the specified position of the eutectic region substrate, it may also include sticking appropriate flux on the LED chip in a flux box.

[0042] 03. After the predetermined heating time is reached, the heating is stopped, the suction nozzle leaves the LED chip, and the eutectic welding of one LED chip is completed.

[0043] 04. Repeat the...

Embodiment 2

[0056] The difference between this embodiment and embodiment 1 is that, as image 3 As shown, before the suction nozzle picks up the LED chips, it also includes:

[0057] 01. The substrate is placed in the substrate loading area, and the substrate is transported from the loading area to the eutectic area under the transport system.

[0058] It can be but not limited to, before the suction nozzle picks up the LED chip, it also includes:

[0059] 02. Place the film disc carrying the LED chip in the chip loading area,

[0060] 03. The suction nozzle sucks the LED chip from the chip loading area.

[0061] 04. Paste appropriate flux on the LED chip in the flux box.

[0062] 05. Heat the suction nozzle to melt the metal solder at the bottom of the LED chip and combine it with the designated position of the eutectic region substrate. The substrate may be a ceramic substrate, a copper substrate, an aluminum substrate, or the like. It is possible, but not limited to, to heat the s...

Embodiment 3

[0070] In this embodiment, a ceramic material substrate is used, and the LED chip whose bottom is gold-tin alloy (Au:Sn=80%:20%) is used.

[0071] The ceramic substrate and the LED chip are respectively placed on the substrate loading area and the chip loading area, and the LED chip is picked up by using a suction nozzle, and the soldering flux is pasted on it. The pulse heating system starts to heat the suction nozzle, and after the temperature reaches the melting point of metal solder (282°C), the LED chip is placed on the ceramic substrate that has been transferred from the loading area to the eutectic area, and it stays for 0.5 Seconds later, stop heating the suction nozzle, and at the same time, the suction nozzle leaves the LED chip to complete the eutectic of one LED chip.

[0072] Place the ceramic substrate after several LED chip eutectics have been completed on a flat table, fix a frame 0.05mm higher than the LED chip around the ceramic substrate, and place the glue ...

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PUM

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Abstract

The invention relates to the LED field and discloses a flip eutectic LED packaging method. The flip eutectic LED packaging method comprises steps that, an LED chip is absorbed by a nozzle, the nozzle is heated, metal solder at the bottom portion of the LED chip is made to melt and combines with a designated position of an eutectic zone substrate, after reaching the predetermined heating time, heating is stopped, the nozzle separates from the LED chip, so eutectic welding of the LED chip is accomplished, operation is repeated, eutectic welding of LED chips in predetermined quantity is accomplished, glue sealing processing on the LED chips in predetermined quantity after eutectic welding is carried out, and the LED chips are packaged. The flip eutectic LED packaging method has advantages of simple production technology, high efficiency, good quality and low cost.

Description

Technical field [0001] The present invention involves the LED field, and it specially involves a pour -in common crystal LED packaging method. Background technique [0002] Common crystal LED products have the advantages of good thermal conductivity and stable performance, which is a trend of LED development. [0003] Common crystals have the division of formal together and inverted common crystals. After completing the common crystals, the formation of the leading welding is still needed.Extremely connect, no welding line process. [0004] At present, the main ways of common crystals are: [0005] 1. Help welding common crystals.Point welded on the substrate, place the LED chip on the substrate, and then melt the metal welded at the bottom of the LED chip in a return welding method. When cooling, the LED chip is fixed on the substrate.The disadvantage of this method is that the efficiency is low, and the product is long in the entire process, which can easily lead to misalignmen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/62H01L33/50H01L33/58
CPCH01L33/48H01L33/005H01L33/50H01L33/58H01L33/62H01L2933/0008
Inventor 雷训金代克明董宗雷
Owner HUIZHOU DAYAWAY EVER BRIGHT ELECTRONICS IND CO LTD
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