Electrical insulating epoxy resin composition and preparation method thereof

An epoxy resin and electrical insulation technology, applied in the field of materials, can solve the problems of reducing the electrical properties such as the breakdown strength of the epoxy resin, losing the mechanical properties of the epoxy resin system, affecting the casting process, etc., achieving excellent comprehensive performance and improving electrical properties. performance, the effect of improving the filling rate

Active Publication Date: 2015-04-01
INST OF PROCESS ENG CHINESE ACAD OF SCI +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The addition of micron-scale inorganic fillers can make the shrinkage rate of the insulating part and the molding mold similar, and improve the mechanical and thermal properties of the epoxy resin, but it will reduce the electrical properties such as the breakdown strength of the epoxy resin
[0003] At present, there are also many reports at home and abroad on the use of micro-nano compounding technology to modify insulating epoxy resin compositions. For example, WO 2006008422A1 discloses the use of micron-scale fillers and nano-scale fillers to prepare insulating epoxy resins. CN 101816049A discloses the use of partial pretreatment The epoxy resin for insulation prepared by micronano filler, CN 101506301A discloses the epoxy resin material for insulation prepared by using micron filler, nano filler and elastomer particles as mixed filler. The above technology can improve the epoxy resin due to the addition of a certain proportion of nanoparticles. The electrical properties of the resin system, but usually too much nano particles will lose the mechanical properties of the epoxy resin system, and the viscosity of the system will increase, which will affect the casting process

Method used

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  • Electrical insulating epoxy resin composition and preparation method thereof
  • Electrical insulating epoxy resin composition and preparation method thereof
  • Electrical insulating epoxy resin composition and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1-5

[0060] According to Table 1, the components of the formula amount were mixed evenly at 135°C by the high-speed disperser DISPERMAT of VMA-Getzmann Company to form an epoxy pouring formula. After vacuum degassing, it was poured into a preheated mold. The curing conditions were: Cured at 115°C for 15h, then at 140°C for 12h. Curing and molding to obtain electrical insulating epoxy resin composition examples 1-5.

[0061] The micron α-Al that adopts in the embodiment 1-5 of the present invention 2 o 3 , nano-SiO 2 The hollow spheres are all surface-treated, and the surface treatment agent is γ-glycidoxypropyltrimethoxysilane.

[0062] The nanometer SiO that adopts in the embodiment of the present invention 1-5 2 The hollow sphere is hollow with an inner diameter of 100 nm and an outer wall thickness of 10 nm.

[0063] Nano-SiO in Example 1-5 of the present invention 2 The bulk density of hollow spheres is 65Kg / m 3 .

[0064] The formulations and properties of the electric...

Embodiment 6-8

[0081] According to Table 5, the components of the formula amount were mixed evenly at 120°C by the high-speed disperser DISPERMAT of VMA-Getzmann Company to form an epoxy pouring formula. After vacuum degassing, it was poured into a preheated mold. The curing conditions were: Curing at 105°C for 20 hours, and curing at 150°C for 16 hours. Curing and molding to obtain electrical insulation epoxy resin composition examples 6-8.

[0082] The micron α-Al that adopts in the embodiment 6-8 of the present invention 2 o 3 , Quartz Silica, Nano SiO 2 The hollow spheres are all surface-treated, and the surface treatment agent is γ-glycidoxypropyltrimethoxysilane.

[0083] The nanometer SiO that adopts in the embodiment of the present invention 6 2 The hollow inner diameter of the hollow ball is 50nm, the outer wall thickness is 10nm, and the bulk density is 114Kg / m 3 It is 80nm that hollow inner diameter among the embodiment 7, and outer wall thickness is 15nm, and packing density...

Embodiment 9-14

[0092] According to Table 7, the components of the formula amount were mixed evenly at 150°C by the high-speed disperser DISPERMAT of VMA-Getzmann Company to form an epoxy pouring formula. After vacuum degassing, it was poured into a preheated mold. The curing conditions were: Cured at 125°C for 8h, then at 150°C for 6h. Curing and molding to obtain electrical insulating epoxy resin composition examples 9-14.

[0093] Micron α-Al adopted in the embodiment of the present invention 9-14 2 o 3 , Quartz Silica, Nano SiO 2 The hollow spheres are all surface-treated, and the surface treatment agent is γ-glycidoxypropyltrimethoxysilane.

[0094] The nanometer SiO that adopts in the embodiment of the present invention 9-14 2 The hollow sphere is hollow with an inner diameter of 90nm and an outer wall thickness of 10nm.

[0095] Bulk density in the embodiment of the present invention 9-14 is 82Kg / m 3 .

[0096] The formulations and properties of the electrical insulating epoxy r...

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Abstract

The invention discloses an electrical insulating epoxy resin composition which consists of the following components: (A) one or more than two epoxy resins; (B) one or more than two anhydride curing agents; (C) a micron inorganic particle composition which accounts for 60-75% of the mass of the electrical insulating epoxy resin composition; and (D) one or more than two inorganic hollow nanoparticles which account for 0.05-0.8% of the mass percentage of the component (A), and the component (C) includes two particles differing in size. The epoxy resin composition disclosed by the invention is low in dielectric constant, and is capable of improving such electrical properties as breakdown strength and arc-resistance time as well as mechanical properties.

Description

technical field [0001] The invention belongs to the field of materials, in particular, the invention relates to an electrical insulating epoxy resin composition and a preparation method. Background technique [0002] Epoxy insulating parts are widely used in power transmission and transformation equipment such as transformers, switches, transformers, wall bushings, etc. These insulating parts play the role of electrical insulation and load bearing, and their performance will directly affect the performance of power transmission and transformation equipment. Insulation performance and operational reliability. The current epoxy insulation is mainly based on the addition of micron-scale inorganic fillers, such as micron-scale alumina and silicon oxide. The addition of micron-scale inorganic fillers can make the shrinkage rate of the insulating part and the molding mold similar, and improve the mechanical and thermal properties of the epoxy resin, but it will reduce the electri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C08K7/26C08K3/22C08K3/36
Inventor 王好盛张冬海薛杨陈赟张婧坤陈运法高锋张晖张忠尹立张翀田浩张柳丽李继承郝留成
Owner INST OF PROCESS ENG CHINESE ACAD OF SCI
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