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Latent curing epoxy resin binder diamond grinding tool and preparation method thereof

A technology of epoxy binder and epoxy resin, which is applied in the direction of metal processing equipment, grinding/polishing equipment, abrasives, etc., and can solve the problems of heat resistance, short service life, difficult adjustment of resin liquid viscosity, and difficult adjustment of curing speed, etc. problems, achieve good wear resistance, improve self-sharpness, and product compactness

Active Publication Date: 2015-04-08
广东奔朗新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The products prepared by the hot pressing process have good heat resistance, but the process is relatively complicated, the energy consumption is high, and the workload of the workers is heavy; the pouring process is relatively simple and the cost is low
At present, the pouring process of epoxy resin mostly adopts room temperature curing, and the curing speed is not easy to adjust, either the operating time is too short or the curing time is too long; the viscosity of the resin liquid is not easy to adjust, and the air bubbles are difficult to discharge; the heat resistance and service life of the prepared products are not as good as Hot Pressed Products

Method used

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  • Latent curing epoxy resin binder diamond grinding tool and preparation method thereof
  • Latent curing epoxy resin binder diamond grinding tool and preparation method thereof
  • Latent curing epoxy resin binder diamond grinding tool and preparation method thereof

Examples

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Effect test

no. 1 example

[0026] The diamond abrasive tool of the latent curing epoxy resin bond, its working layer is mainly made of epoxy resin bond, diamond abrasive, curing agent, accelerator, water-soluble porogen and filler; wherein, epoxy resin 17 Parts, 4 parts of 230# diamond for diamond abrasive, 14 parts of methyl tetrahydrophthalic anhydride for curing agent, 2 parts of DMP-30 for accelerator, 15 parts of sodium chloride for water-soluble porogen, and 16 parts of zinc oxide, 2 parts PTFE powder and 30 parts aluminum oxide.

[0027] Its preparation method comprises steps as follows:

[0028] (1) Prepare latent curing type epoxy binder: Epoxy resin (epoxy value 51), methyltetrahydrophthalic anhydride and DMP-30 are mechanically mixed to obtain latent curing type epoxy binder;

[0029] (2) Mixing: After mixing zinc oxide, polytetrafluoroethylene powder, aluminum oxide, and sodium chloride evenly, add 30-85 parts of latent curing epoxy binder prepared in the diamond abrasive and step (1) and p...

no. 2 example

[0033] The diamond abrasive tool of this latent curing type epoxy resin bond is different from the first embodiment in that: 17 parts of epoxy resin, 8 parts of 3000# diamond are selected for the diamond abrasive, and 14 parts of methyltetrahydrophthalic anhydride are selected for use as the curing agent , choose 2 parts of DMP-30 as accelerator, 30 parts of sodium chloride as water-soluble porogen, 9 parts of cerium oxide and 20 parts of alumina as filler.

[0034] The preparation method and other undescribed parts are the same as those in the first embodiment, and will not be analyzed and described here.

no. 3 example

[0036] The diamond abrasive tool of this latent curing type epoxy resin bond is different from the first embodiment in that: 17 parts of epoxy resin, 4 parts of 230# diamond are used for diamond abrasive, and 14 parts of methyltetrahydrophthalic anhydride are selected for use as curing agent , choose 2 parts of 2-ethyl-4-methylimidazole as accelerator, choose 15 parts of sodium chloride as water-soluble porogen, choose 16 parts of zinc oxide, 2 parts of polytetrafluoroethylene powder and 30 parts of aluminum oxide as filler.

[0037] The preparation method and other undescribed parts are the same as those in the first embodiment, and will not be analyzed and described here.

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Abstract

The invention provides a latent curing epoxy resin binder diamond grinding tool and a preparation method thereof. The latent curing epoxy resin binder diamond grinding tool is characterized in that a working layer is mainly prepared from the following materials in parts by weight: 100 parts of an epoxy resin binder, 2-20 parts of a diamond abrasive material, 70-100 parts of a curing agent, 0.5-3 parts of an accelerant, 5-30 parts of a water-soluble pore-forming agent and 5-7 parts of a filler. The preparation method comprises the following steps: first mixing part of the materials to prepare the latent curing epoxy resin binder; then mixing all of the materials; finally casting the mixed materials into a mould to cure the material to obtain the latent curing epoxy resin binder diamond grinding tool. Compared with similar hot-press molded products, the latent curing epoxy resin binder diamond grinding tool adopting a casting process has the following advantages: the operational time is long, the process is simple, the cost and the energy consumption is low, the production efficiency is high, and the heat resistance, the abrasion resistance and the compactness are good; the water-soluble pore-forming agent generates pores in a water milling process so as to achieve the functions of removing chips, cooling and improving the self-sharpening property.

Description

technical field [0001] The invention relates to a diamond grinding tool, in particular to a diamond grinding tool with a latent curing epoxy resin bond and a preparation method thereof. Background technique [0002] At present, there are mainly two preparation processes for epoxy resin diamond grinding blocks: hot pressing and casting. The products prepared by the hot pressing process have good heat resistance, but the process is relatively complicated, the energy consumption is high, and the workload of the workers is heavy; the pouring process is relatively simple and the cost is low. At present, the pouring process of epoxy resin mostly adopts room temperature curing, and the curing speed is not easy to adjust, either the operating time is too short or the curing time is too long; the viscosity of the resin liquid is not easy to adjust, and the air bubbles are difficult to discharge; the heat resistance and service life of the prepared products are not as good as Hot-pre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/32B24D18/00
CPCB24D3/32B24D3/344B24D18/0009
Inventor 罗浩川周华
Owner 广东奔朗新材料股份有限公司
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