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A kind of high-adhesion low-temperature curing conductive silver paste and preparation method thereof

A conductive silver paste, high-adhesion technology, used in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve problems such as resistance increase, achieve low resistance value, reduce resistance, improve Effect of product resistance rise problem

Active Publication Date: 2017-02-22
BAODING LUCKY PHOTOGRAPH CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, in order to improve the adhesion of low-temperature conductive paste, it is considered to add an adhesion promoter, but the addition of the adhesion promoter will cause a significant increase in resistance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0036] The preparation method of the present invention comprises the following steps:

[0037] (1) Mixing flaky silver powders: Weigh the three flaky silver powders A, B, and C in corresponding quantities, and mix them evenly under high-speed stirring;

[0038] (2) Preparation of organic carrier: Weigh the corresponding parts of organic solvent and polymer resin, stir and mix evenly at a high speed under the condition of 60-90 ℃, lower the temperature to 50 ℃, add the corresponding parts of p-toluenesulfonic acid, stir Dissolve evenly to obtain an organic carrier, which is set aside;

[0039] (3) Preparation of conductive silver paste: Add the mixed flake silver powder into the organic carrier, mix and disperse with a disperser, weigh the corresponding number of coupling agents and add it, and then grind it with a three-roll mill until the fineness is less than 7.5 μm, the finished conductive silver paste is obtained.

Embodiment 1

[0042] (1) Mix flake silver powder: weigh 24 grams of flake silver powder A, 12 grams of flake silver powder B, and 4 grams of flake silver powder C, and mix evenly under high-speed stirring;

[0043](2) Preparation of organic carrier: Weigh 34 grams of mixed dibasic acid ester, 9 grams of isophorone, add 8 grams of VAGH vinyl acetate resin, 2 grams of KR-120 aldehyde and ketone resin, stir and mix evenly at 80°C , lower the temperature to 50°C, add 1 gram of p-toluenesulfonic acid, stir and dissolve evenly, and prepare an organic carrier for later use;

[0044] (3) Preparation of conductive silver paste: Add the mixed flake silver powder into the carrier, mix and disperse with a disperser, add 1 g of KBM403 silane coupling agent, 5 g of TYZOR TE titanate coupling agent, and grind with three rolls Machine grinding to a fineness of less than 7.5 μm to obtain about 100 grams of conductive silver paste.

Embodiment 2

[0046] (1) Mix flake silver powder: weigh 24 grams of flake silver powder A, 12 grams of flake silver powder B, and 4 grams of flake silver powder C, and mix evenly under high-speed stirring;

[0047] (2) Preparation of organic vehicle: Weigh and mix 30 grams of dibasic acid ester, 10 grams of isophorone, add 7.5 grams of VAGH vinyl acetate resin, 2.5 grams of KR-A101 aldehyde resin, stir and mix evenly at 80 ° C, Lower the temperature to 50°C, add 4 grams of p-toluenesulfonic acid, stir and dissolve evenly, and prepare an organic carrier for later use;

[0048] (4) Preparation of conductive silver paste: Add the mixed flaky silver powder into the carrier, add 0.8 grams of KBM903 silane coupling agent, 5.2 grams of TYZOR AA-75 titanate coupling agent, mix and disperse with a disperser, and then use The three-roll mill grinds to a fineness of less than 7.5 μm to obtain about 100 grams of conductive silver paste finished product.

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Abstract

The invention provides high adhesive force and low-temperature setting conductive silver paste and a preparing method of the high adhesive force and low-temperature setting conductive silver paste. The conductive silver paste comprises, by mass, 30-55 parts of flake sliver powder, 1-5 parts of p-toluenesulfonic, 6-15 parts of polymer resin, 30-50 parts of organic solvent and 5-8 parts of coupling agent. The flake sliver powder is composed of three kinds of sliver powder with the mass proportion of 6:3:1. The polymer resin is a mixture of aldehyde ketone resin and VAGH or a mixture of aldehyde resin and VAGH, wherein the VAGH accounts for 70-90% of the total polymer resin. The coupling agent is a titanate coupling agent and a silane coupling agent. The adhesive force of the silver paste obtained after the silver paste is printed and dried is obviously increased, and the problem that the resistance of a product is increased due to the introduction of the coupling agent is effectively solved.

Description

technical field [0001] The invention relates to a conductive silver paste, in particular to a conductive silver paste with good pear blossom characteristics and a preparation method thereof. Background technique [0002] Low-temperature curing conductive silver paste is widely used in the screen printing industry of electronic products such as keyboard lines and membrane switches. It is usually made of conductive silver powder, polymer resin, organic solvents, additives, etc. according to the needs of a certain proportion through mechanical mixing. It is prepared by the method, printed on a substrate such as polyethylene terephthalate (PET) with a 150-300 mesh screen, and generally cured at 120-150°C for 30-60 minutes to form a conductive pattern. At present, the technology of low-temperature conductive paste is becoming more and more mature, but with the development of related technologies, new and higher requirements are constantly put forward, that is, to improve electric...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00
Inventor 雒盛林王会吴满旗孙飞王建龙张健
Owner BAODING LUCKY PHOTOGRAPH CHEM