A kind of high-adhesion low-temperature curing conductive silver paste and preparation method thereof
A conductive silver paste, high-adhesion technology, used in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve problems such as resistance increase, achieve low resistance value, reduce resistance, improve Effect of product resistance rise problem
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preparation example Construction
[0036] The preparation method of the present invention comprises the following steps:
[0037] (1) Mixing flaky silver powders: Weigh the three flaky silver powders A, B, and C in corresponding quantities, and mix them evenly under high-speed stirring;
[0038] (2) Preparation of organic carrier: Weigh the corresponding parts of organic solvent and polymer resin, stir and mix evenly at a high speed under the condition of 60-90 ℃, lower the temperature to 50 ℃, add the corresponding parts of p-toluenesulfonic acid, stir Dissolve evenly to obtain an organic carrier, which is set aside;
[0039] (3) Preparation of conductive silver paste: Add the mixed flake silver powder into the organic carrier, mix and disperse with a disperser, weigh the corresponding number of coupling agents and add it, and then grind it with a three-roll mill until the fineness is less than 7.5 μm, the finished conductive silver paste is obtained.
Embodiment 1
[0042] (1) Mix flake silver powder: weigh 24 grams of flake silver powder A, 12 grams of flake silver powder B, and 4 grams of flake silver powder C, and mix evenly under high-speed stirring;
[0043](2) Preparation of organic carrier: Weigh 34 grams of mixed dibasic acid ester, 9 grams of isophorone, add 8 grams of VAGH vinyl acetate resin, 2 grams of KR-120 aldehyde and ketone resin, stir and mix evenly at 80°C , lower the temperature to 50°C, add 1 gram of p-toluenesulfonic acid, stir and dissolve evenly, and prepare an organic carrier for later use;
[0044] (3) Preparation of conductive silver paste: Add the mixed flake silver powder into the carrier, mix and disperse with a disperser, add 1 g of KBM403 silane coupling agent, 5 g of TYZOR TE titanate coupling agent, and grind with three rolls Machine grinding to a fineness of less than 7.5 μm to obtain about 100 grams of conductive silver paste.
Embodiment 2
[0046] (1) Mix flake silver powder: weigh 24 grams of flake silver powder A, 12 grams of flake silver powder B, and 4 grams of flake silver powder C, and mix evenly under high-speed stirring;
[0047] (2) Preparation of organic vehicle: Weigh and mix 30 grams of dibasic acid ester, 10 grams of isophorone, add 7.5 grams of VAGH vinyl acetate resin, 2.5 grams of KR-A101 aldehyde resin, stir and mix evenly at 80 ° C, Lower the temperature to 50°C, add 4 grams of p-toluenesulfonic acid, stir and dissolve evenly, and prepare an organic carrier for later use;
[0048] (4) Preparation of conductive silver paste: Add the mixed flaky silver powder into the carrier, add 0.8 grams of KBM903 silane coupling agent, 5.2 grams of TYZOR AA-75 titanate coupling agent, mix and disperse with a disperser, and then use The three-roll mill grinds to a fineness of less than 7.5 μm to obtain about 100 grams of conductive silver paste finished product.
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Abstract
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