A wafer-level chip-scale atomic vapor cavity packaging method
A wafer-level chip and atomic steam technology, applied in microstructure devices, processing microstructure devices, precision positioning equipment, etc., can solve the problems of miniaturization and high purity that are difficult to balance, and achieve mass production without wasting volume , the effect of miniaturization
Active Publication Date: 2016-04-27
中科泰菲斯(武汉)技术有限公司
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Problems solved by technology
[0009] The present invention at least solves the defect that chamber volume miniaturization and high purity are difficult to balance in the manufacture of existing miniature atomic vapor chambers, and provides a wafer-level chip-sized atomic vapor chamber packaging method
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[0027] The design principle of the present invention is as follows: firstly, through the patterned glue bonding process, an airtight chamber with buffer gas, which can be sealed in the whole piece and can maintain a certain pressure is formed in advance; a relatively independent part of the chamber is reserved, and the required alkali Metal vapor reactants; heating after glue bonding makes the reactants in the pre-chamber undergo in-situ chemical reactions to produce pure alkali metals, and diffuses the alkali metal vapors to the surrounding chambers; then through anodic bonding technology, a relative Independently sealed atomic vapor chamber. Among them, high-purity alkali metal vapor and buffer gas are contained in the chamber that is not placed in the alkali metal vapor reactant in advance; while the reaction residue is left in the chamber where the reactant is placed.
[0028] The packaging method of the present invention adopts semiconductor micro-nano processing technolo...
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The invention relates to the field of MEMS device manufacturing, and particularly discloses a wafer level chip size atomic vapor chamber encapsulating method. The wafer level chip size atomic vapor chamber encapsulating method comprises the following steps: S1. bonding first bonding glass with the surface at one side of silicon wafer with through holes via anodic bonding so as to enable the through holes to form respective individual premolding chambers; S2. arranging alkali metal vapor reactants in part of premolding chambers; S3. bonding second bonding glass with an outer ring at the other side of silicon wafer in the presence of buffer gases by bonding via airtight glue so as to form airtight premolding chambers; S4. heating so as to enable the alkali metal steam reactants to react so as to generate alkali metal vapor; S5. bonding the second bonding glass with the other side surface of the silicon wafer by anodic bonding so as to form respectively individually sealed atomic vapor chambers; and S6. scribing, wherein the chambers in which the alkali metal steam reactants are not put are atomic vapor chamber with the silicon wafer chip sizes. The encapsulating method disclosed by the invention is completely compatible with the traditional manufacturing technology, and has both the volume advantage of a single chamber and the advantage of high vapor purity of double chambers.
Description
technical field [0001] The invention relates to a wafer-level chip-size atomic steam cavity packaging method, which belongs to the fields of MEMS device manufacturing and atomic physics devices. Background technique [0002] In recent years, with the rapid development of digital communication technology, nuclear magnetic resonance gyroscopes, atomic frequency (atomic clocks) and other atomic physical systems have become increasingly important in the fields of positioning, navigation, and timing, and have gradually entered people's daily lives. For example: miniature atomic clocks provide accurate time standards for global positioning systems, astronomical observation systems, radar systems, traffic control systems, and calibration of precision instruments and meters; atomic nuclear magnetic resonance gyroscopes have no mechanical rotating parts, high measurement accuracy, The advantages of insensitivity to overload and vibration have become a new hot spot in the field of ine...
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IPC IPC(8): B81C3/00
Inventor 王逸群姜春宇付思齐林文魁王德稳张宝顺
Owner 中科泰菲斯(武汉)技术有限公司