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Chip packaging method

A chip packaging and chip technology, applied in the direction of microstructure devices, processing microstructure devices, precision positioning equipment, etc., can solve the problems of poor stability, small working temperature, large device size, etc., to improve high temperature resistance and reliability, The effect of stable work performance

Active Publication Date: 2015-04-29
CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Most of the current MEMS packaging methods require wire bonding or soldering for packaging. After packaging, the entire device cannot withstand higher temperatures. Generally speaking, the operating temperature of the device is less than 150°C; at the same time, the stability is poor. Cannot withstand large shocks (>100g), and the overall device size is slightly larger
All of the above reasons limit the further development of MEMS packaging.

Method used

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Experimental program
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Embodiment 1

[0045] First, as shown in FIG. 1 , one end of at least one lead 10 is fixed in a substrate 11 , and each lead 10 passes through the front and back sides of the substrate 11 to be exposed. The leads 10 are fixed in the substrate 11, for example in a special graphite mold. Optional but not limited, the leads 10 are made of metal material such as metal wires, which are used to lead out the electrodes of the packaged chip. The number of the leads 10 can be selected according to the actual situation, generally the same as the number of electrodes to be led out from the packaged chip. Optionally, the aforementioned substrate 11 is a glass substrate blank. Meanwhile, a housing 12 is fixed on the edge of the base plate 11 , and a cavity 20 with an opening is formed by the housing 12 and the base plate 11 . Optionally but not limited, the above-mentioned shell 12 is a metal shell. When the lead wire 10 and the casing 12 are fixed on the substrate 11 , a sintering is performed so that...

Embodiment 2

[0052] refer to Figure 2a As shown, firstly, a substrate 101 is provided, on which a housing 102 is fixed, and the substrate 101 and the housing 102 form a cavity 200 with an opening. Optionally but not limited, the substrate 101 is a glass substrate. Holes are drilled on the substrate 101 at positions corresponding to the packaged chips to form Figure 2b structure shown. In an optional embodiment, the through hole 150 may be formed in the substrate 101 by means of laser, drilling, borax and the like. Those skilled in the art should understand that the casing 102 can be fixed on the substrate 101 first, and then the substrate 101 is punched; or the substrate 101 can be punched first, and then the casing 102 can be fixed on the substrate 100, This does not cause any substantial impact on the invention.

[0053] Such as Figure 2c-2d As shown, the chip 103 with electrodes 104 on one side is placed in the cavity 200 and fixed on the substrate 101 through the encapsulation ...

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Abstract

The invention discloses a chip packaging method. The method specifically comprises the following steps: providing a substrate, wherein multiple penetrated through holes are formed in the substrate, a shell is fixed on the substrate, and a cavity with an opening is formed between the shell and the substrate; placing a chip of which one side is provided with an electrode in the cavity, and fixing the chip on the substrate by virtue of a packaging material, wherein the electrodes faces and is aligned with the through holes; allowing one end of at least one lead to pass through the through holes; connecting the lead and the electrode together by utilizing conductive slurry; and sealing the cavity by utilizing a top cover. According to the method disclosed by the invention, the chip and a glass substrate with a metal wire are sintered and connected together by using the conductive slurry, the chip is subjected to strengthening treatment by virtue of seal glass, and the high temperature resistance and reliability of the device are further greatly improved, so that the working performance of the device is stable under severe conditions.

Description

technical field [0001] The present invention relates to the packaging field, to be precise, relates to a MEMS chip packaging method. Background technique [0002] Micro-Electro-Mechanical System (MEMS, Micro-Electro-Mechanical System) is an advanced manufacturing technology platform, mainly based on semiconductor manufacturing technology. MEMS is the integration of microcircuits and micromachines on a chip according to functional requirements. The size is usually at the millimeter or micron level. Since its rise in the mid-to-late 1980s, it has developed extremely rapidly. It will become a new national economic growth point and an important technical way to improve military capabilities in the 21st century. [0003] The advantages of MEMS are: small size, light weight, low power consumption, good durability, low price, and stable performance. The emergence and development of micro-electromechanical systems is the result of scientific and innovative thinking, making the evo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00
Inventor 陈敏张永平马清杰
Owner CHINA RESOURCES MICROELECTRONICS (CHONGQING) CO LTD