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Fluorescent powder precipitation resistant LED package powder glue

A technology of LED packaging and phosphor powder, applied in adhesives, luminescent materials, other rubber adhesives, etc., can solve the problem of uneven distribution of phosphor powder, achieve uniform light color, improve utilization rate, and high quality

Inactive Publication Date: 2015-04-29
广东赛铭照明科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the defects of the prior art, and the purpose is to provide an anti-fluorescent powder precipitation LED packaging powder glue, which is used to solve the uneven distribution of phosphor powder in the powder glue after the powder glue is cured. The problem of uniformity, the phosphor particles are not easy to settle under the action of gravity. When the powder glue is cured, the phosphor powder will be evenly distributed around the powder glue, which improves the utilization rate of the phosphor powder and makes the light emitted by the LED device The color is more uniform, the effect is better, and the quality is higher

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0009] An anti-fluorescent powder precipitation LED packaging powder described in Example 1 of the present invention is composed of the following components mixed: 80 parts of ceramsite powder, 60 parts of redispersible latex powder, and 30 parts of rare earth long-lasting luminous Powder, 20 parts of yellow fluorescent powder, 12 parts of sodium polyacrylate, 10 parts of hydroxypropyl methylcellulose, 15 parts of guar gum, 15 parts of silica gel, 10 parts of copper sulfate pentahydrate, 10 parts of vitriol.

Embodiment 2

[0011] An anti-fluorescent powder precipitation LED packaging powder described in Example 2 of the present invention is composed of the following components mixed: 90 parts of ceramsite powder, 80 parts of redispersible latex powder, and 50 parts of rare earth long-lasting luminous Powder, 30 parts of yellow fluorescent powder, 15 parts of sodium polyacrylate, 12 parts of hydroxypropyl methylcellulose, 20 parts of guar gum, 25 parts of silica gel, 15 parts of copper sulfate pentahydrate, 12 parts of vitriol.

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PUM

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Abstract

The invention discloses fluorescent powder precipitation resistant LED package powder glue consisting of the following components mixed in parts by weight: 80-90 parts of ceramisite powder, 60-80 parts of re-dispersible latex powder, 30-50 parts of rare earth long-acting luminous powder, 20-30 parts of yellow fluorescent powder, 12-15 parts of sodium polyacrylate, 10-12 parts of hydroxypropyl methyl cellulose, 15-20 parts of guar gum, 15-25 parts of silica gel, 10-15 parts of cupric sulfate pentahydrate and 10-12 parts of green vitriol. The fluorescent powder precipitation resistant LED package powder glue is used for solving the problem that after the solidification of powder glue, the fluorescent powder is not uniformly distributed in the powder glue; and fluorescent powder particles cannot be precipitated easily under the action of gravity, and after the solidification of the powder glue is finished, the fluorescent powder can be uniformly distributed around the powder glue, so that the utilization ratio of the fluorescent powder is improved, the color of the light emitted by an LED device is more uniform, the effect of the LED device is better, and the quality of the LED device is higher.

Description

technical field [0001] The invention relates to an LED encapsulating rubber powder, in particular to an anti-fluorescent powder precipitation LED encapsulating powder used for an LED encapsulating device. Background technique [0002] At present, the high-power white LEDs currently used are all blue LEDs that excite the yellow phosphor on the surface to emit yellow light, and the blue light mixed with yellow light presents white light vision. Since the phosphor is a rare earth compound, its density is much higher than that of epoxy resin and silica gel used as powder mixing glue. When the LED chip is dispensed and cured, the phosphor powder is prone to precipitate in the powder glue. This phenomenon leads to a decrease in the utilization rate of the phosphor powder, resulting in waste, and there is a problem of uneven distribution of the phosphor powder, resulting in localized light emitted by the lamp. Yellowish. Contents of the invention [0003] The purpose of the pre...

Claims

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Application Information

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IPC IPC(8): C09J121/00C09J105/00C09J183/04C09J101/28C09J11/04H01L33/50C09K11/02
Inventor 冯兵
Owner 广东赛铭照明科技有限公司
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