Large single-layer ceramic passive component plain sheet with composite electrode layer
A technology of passive components and ceramics, which is applied in the direction of electrical components, fixed capacitor electrodes, resistor terminals/electrodes, etc. It can solve the problems of affecting the electrical function of the product, increasing the impedance, and being unable to create the characteristics of the electrode surface and the body to separate the convex platform.
Inactive Publication Date: 2015-04-29
惠州市鑫迪精密科技有限公司
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Problems solved by technology
[0010] Due to the limitation of the dry pressing mold, the edges of the above-mentioned large ceramic passive component substrates are all right angles, and it is impossible to create the feature of separating the electrode surface and the body. When the electrode surface is coated, it is very easy to produce overflow. Questions such as degree and inconsistency
The electrical function of the product is greatly affected
[0011] The traditional silver paste and copper paste are screen printed and then sintered for the second time, or the traditional vacuum sputtering copper electrode is weak in resistance to solder alloying. Under the impact of high voltage and current, it cannot withstand high temperature. The electrode liquefies and the impedance rises
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[0063] The implementation of the present invention is described below with specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0064] Embodiments of the present invention are described below with reference to the drawings. It should be noted that the following drawings are simplified schematic diagrams, and only schematically illustrate the basic idea of the present invention, so only structures related to the present invention are illustrated in the drawings instead of The drawing is based on the number, shape and size of components in actual implementation. The shape, quantity and proportion of each component in actual implementation are not limited to those shown in the illustration, and can be changed according to actual design needs, which are described first.
[0065] Please refer to figure 1 As shown, the present invention is a substrate of a lar...
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Abstract
The present invention relates to a large single-layer ceramic passive component plain sheet with a composite electrode layer. The large single-layer ceramic passive component plain sheet is a structural body of square shape or perfect round sheet. Features obtained through the ceramic injection molding technique include: an electrode projection on each of the two sides, a rounded edge on the electrode projection, a junction between the electrode projection and a plain sheet body, and the edge of the plain sheet body. After subjecting to a composite debonding method, atmosphere and pressure controlled sintering, low-temperature vacuum sputtering is adopted to coat the composite electrode layer, thereby forming the large single-layer ceramic passive component plain sheet with a composite electrode layer.
Description
technical field [0001] A large single-layer ceramic passive component has a substrate with a composite electrode layer. The large single-layer ceramic passive component substrate is a square or circular structure. The following features are produced by ceramic injection molding technology, including: both sides have The electrode boss, the rounded electrode boss edge, the junction of the electrode boss and the substrate body, and the edge of the substrate body are compounded by low-temperature vacuum sputtering after sintering by composite debonding method, atmosphere and pressure control. The electrode layer becomes a substrate of a large single-layer ceramic passive element with a composite electrode layer. The technical field of the present invention includes: ceramic powder injection molding, composite debonding, atmosphere and pressure controlled sintering, and low-temperature vacuum sputtering composite Coating technology. Background technique [0002] Single-layer ce...
Claims
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IPC IPC(8): H01G4/005H01G4/12H01C1/14H01C7/10H01L41/047H10N30/87
Inventor 邱耀弘邱瑞宝王国仲
Owner 惠州市鑫迪精密科技有限公司