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Rigid-flex circuit board and production method thereof

A combination of soft and hard, production method technology, applied in the direction of printed circuit manufacturing, printed circuit, printed circuit assembly of electric components, etc., can solve the problems of complex processing process and operability, etc., to save processing steps, simple manufacturing process, save The effect of processing time

Inactive Publication Date: 2015-04-29
PEKING UNIV FOUNDER GRP CO LTD +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Through the above analysis, it can be seen that the existing manufacturing process requires window opening, and for the soft-rigid circuit board with thin dielectric layer, gaskets must be used in the manufacturing process, and the processing flow and operability are relatively complicated.

Method used

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  • Rigid-flex circuit board and production method thereof
  • Rigid-flex circuit board and production method thereof
  • Rigid-flex circuit board and production method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0059] 1) Make circuit patterns on the flexible circuit substrate 11, and make alignment target holes and targets (not shown in the figure) on the flexible circuit substrate 11, and paste the cover film 12 to complete the production of the flexible circuit board 1, as Figure 2a As shown, wherein, in this embodiment, the flexible circuit substrate 11 includes a PI layer 53, an Ad adhesive layer 52 arranged on both sides of the PI layer 53, a copper foil layer 51 arranged on the Ad adhesive layer 52, and the cover film 12 includes Ad glue layer 52 and PI layer 53;

[0060] 2) Prepare the protective film 2. A protective film with a thickness of 12 μm or 25 μm can be selected. In this embodiment, the protective film 2 with a thickness of 25 μm is preferred. The protective film 2 is cut into small pieces according to the shape of the exposed area of ​​the flexible board 1, and the protective film 2 attached to the exposed area, such as Figure 2b shown;

[0061] 3) According to ...

Embodiment 2

[0067] 1) if Figure 3a As shown, the circuit pattern is made on the flexible circuit substrate 11, and the cover film 12 is attached to complete the production of the flexible circuit board 1;

[0068] 2) Prepare the protective film 2. The protective film 2 with a thickness of 12 μm or 25 μm can be selected. In this embodiment, the protective film 2 with a thickness of 25 μm is preferred. Cut the protective film 2 into small pieces according to the shape of the exposed area of ​​the flexible board 1, and Attach the protective film 2 on the exposed area, such as Figure 3b shown;

[0069] 3) Prepare a copper clad laminate 4 of a certain thickness (the copper clad laminate 4 includes a copper foil layer 51 and a substrate 41), and make alignment target holes and targets on one side;

[0070] 4) According to the stacking requirements, stack the soft board 1 with the protective film 2, the prepreg 3, and the copper clad laminate 4 with the alignment target in order, and press t...

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Abstract

The invention provides a production method of a rigid-flex circuit board as well as the rigid-flex circuit board. The production method of the rigid-flex circuit board comprises the following steps: a flexible board is provided; a strippable protection film is attached to a to-be-exposed area of the flexible board; a copper foil layer, a prepreg and the flexible board, or a rigid board, the prepreg and the flexible board are laminated and compressed according to a stacking requirement; the circuit board after compression is subjected to production processing, and a semi-finished rigid-flex circuit board product with well-produced graphics and lines is obtained; and depth-control cutting is performed on the board surface of the semi-finished rigid-flex circuit board product along boundary lines corresponding to the exposed area, and off-cut materials and the protection film are taken out. According to the production method of the rigid-flex circuit board, windowing on the prepreg or the rigid board is not required during production of the rigid-flex circuit board, and the process is simple; the method is applied to production of the rigid-flex circuit board with thicker or thinner dielectric layer, and the application range is wide; and a gasket is not required during production of the rigid-flex circuit board with the thinner dielectric layer, and the cost is low.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to a method for manufacturing a rigid-flex circuit board and a rigid-flex circuit board manufactured by the method. Background technique [0002] Rigid-flex circuit board refers to a printed circuit board that contains one or more hard areas and one or more soft areas, and is formed by selectively laminating hard boards and soft boards in a certain order. Connect via metallized holes. Rigid-flex circuit boards have both the durability of hard boards and the flexibility of soft boards. They are characterized by miniaturization, installation flexibility and the ability to meet the requirements of three-dimensional assembly. They are especially suitable for precision applications such as portable electronic products, medical electronic products, and military equipment. Electronic applications. [0003] The manufacturing process of the soft-rigid board is very complicated. Acco...

Claims

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Application Information

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IPC IPC(8): H05K3/36
CPCH05K3/365H05K1/147
Inventor 吴会兰黄勇
Owner PEKING UNIV FOUNDER GRP CO LTD
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