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A kind of electroless gold-plated palladium bonded silver alloy wire and preparation method thereof

A technology of electroless gold plating and silver alloy, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., which can solve the problem of poor oxidation resistance and sulfuration resistance, insufficient nickel-palladium-gold binding, and integrated circuits cannot be used normally To achieve the effect of improving oxidation resistance and vulcanization resistance, meeting packaging and use requirements, and uniform coating

Active Publication Date: 2016-11-02
北京达博有色金属焊料有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the particularity of COB module packaging, COB module packaging is different from IC and LED packaging. After packaging, the bonding wire is completely exposed to the air, and the ordinary bonding silver alloy wire has poor oxidation resistance and sulfuration resistance. , at the same time, the combination of the bonding silver alloy wire and the nickel-palladium-gold on the gold finger of the packaging is not good enough, causing the integrated circuit to not work normally

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The chemical composition of the bonded silver alloy wire is: the mass percentage of gold is 1.5%, the mass percentage of cerium is 0.05%, the mass percentage of lanthanum is 0.05%, the balance is silver and unavoidable impurities, and the mass percentage of silver is greater than 97.0%.

[0024] The method for electroless gold-plating palladium bonding silver alloy wire comprises the following steps:

[0025] (1) Casting and wire drawing: the casting temperature is 1000°C, the heating method is intermediate frequency heating, and the vacuum degree is 1*10 -5 Mpa, the refining time is 40 minutes, the intermittent casting method is adopted during continuous casting, the continuous casting speed is 400mm / min, the diameter of the formed silver alloy wire billet is 10mm, and the wire drawing speed is 300m / min.

[0026] (2) Electroless gold-plating palladium layer: the gold-palladium layer is plated on the surface of the bonded silver alloy wire by electroless plating. When ...

Embodiment 2

[0030] The chemical composition of the bonded silver alloy wire is: the mass percentage of gold is 2.0%, the mass percentage of cerium is 0.02%, the mass percentage of lanthanum is 0.02%, the balance is silver and unavoidable impurities, and the mass percentage of silver is greater than 97.0%.

[0031] The method for electroless gold-plating palladium bonding silver alloy wire comprises the following steps:

[0032] (1) Casting and wire drawing: the casting temperature is 1200°C, the heating method is intermediate frequency heating, and the vacuum degree is 1*10 -5 Mpa, the refining time is 20 minutes, the intermittent casting method is adopted during continuous casting, the continuous casting speed is 200mm / min, the diameter of the formed silver alloy wire billet is 4mm, and the wire drawing speed is 100m / min.

[0033] (2) Electroless gold-plating palladium layer: the gold-palladium layer is plated on the surface of the bonded silver alloy wire by electroless plating. When g...

Embodiment 3

[0037]The chemical composition of the bonded silver alloy wire is: the mass percentage of gold is 1.7%, the mass percentage of cerium is 0.03%, the mass percentage of lanthanum is 0.03%, the balance is silver and unavoidable impurities, and the mass percentage of silver is greater than 97.0%.

[0038] The method for electroless gold-plating palladium bonding silver alloy wire comprises the following steps:

[0039] (1) Casting and wire drawing: the casting temperature is 1100°C, the heating method is intermediate frequency heating, and the vacuum degree is 1*10 -5 Mpa, the refining time is 30 minutes, the intermittent casting method is adopted during continuous casting, the continuous casting speed is 300mm / min, the diameter of the formed silver alloy wire billet is 5mm, and the wire drawing speed is 200m / min.

[0040] (2) Electroless gold-plating palladium layer: the gold-palladium layer is plated on the surface of the bonded silver alloy wire by electroless plating. When go...

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PUM

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Abstract

The invention discloses an electroless gold-plated palladium bonded silver alloy wire. The chemical composition of the bonded silver alloy wire is: the mass percentage of gold is 1.5%-2.0%, the mass percentage of cerium is 0.02%-0.05%, and the mass percentage of lanthanum is The mass percentage is 0.02%‑0.05%, and the balance is silver and unavoidable impurities. The preparation method of the electroless gold-plated palladium-bonded silver alloy wire of the present invention includes the steps of melting and drawing, electroless gold-plating palladium layer, annealing, cleaning and rewinding, and various process parameters are reasonably selected in the preparation process. The electroless gold-plated palladium-bonded silver alloy wire used for COB module packaging and the preparation method thereof provided by the present invention have good oxidation resistance and vulcanization performance, and good combination with nickel-palladium-gold on the gold finger, which meets the packaging requirements. and usage requirements.

Description

technical field [0001] The invention relates to the field of metal bonding wires, in particular to a chemically gold-plated palladium bonding wire and a preparation method thereof. Background technique [0002] Since gold is a precious metal, the price of gold is expensive, and the cost of COB module packaging is also very high, so it can be considered to replace gold wire with bonding silver alloy wire. However, due to the particularity of COB module packaging, COB module packaging is different from IC and LED packaging. After packaging, the bonding wire is completely exposed to the air, and the ordinary bonding silver alloy wire has poor oxidation resistance and sulfuration resistance. , At the same time, the combination of the bonding silver alloy wire and the nickel-palladium-gold on the gold finger for packaging is not good enough, causing the integrated circuit to not work normally. Contents of the invention [0003] In view of the above problems, the present invent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49
CPCH01L24/43H01L2224/43848H01L2224/45139H01L2224/45144H01L2224/45565H01L2924/00011H01L2224/45H01L2224/43H01L2924/01079H01L2924/01058H01L2924/01057H01L2924/01201H01L2224/45164H01L2224/45644H01L2924/00015H01L2924/20106H01L2924/20107H01L2924/20108H01L2924/20109H01L2924/2011H01L2224/45664H01L2924/013H01L2924/00H01L2924/01049H01L2924/00012H01L2924/01005
Inventor 周晓光向翠华闫茹
Owner 北京达博有色金属焊料有限责任公司
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