Succinimide silver plating solution and electroplating method

A succinimide and electroplating solution technology, applied in the field of silver plating process, can solve the problems of poor discoloration resistance of the coating, less than ideal weldability, and insufficient stability of the plating solution, and achieves good stability, anti-discoloration and Strong weldability, improved densification and smoothness

Inactive Publication Date: 2015-05-13
WUXI XUEJIANG ENVIRONMENT ENG EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the pollution problem of cyanide-containing silver plating has been solved to a certain extent, these cyanide-free silver plating generally have

Method used

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  • Succinimide silver plating solution and electroplating method
  • Succinimide silver plating solution and electroplating method
  • Succinimide silver plating solution and electroplating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] The formula of succinimide silver plating bath is as follows:

[0038]

[0039] Plating process conditions: the pulse width of a single pulse square wave current is 1ms, the duty cycle is 20%, and the average current density is 0.3A / dm 2 ; The pH is 8, the temperature is 15°C, and the plating time is 60min.

Embodiment 2

[0041] The formula of succinimide silver plating bath is as follows:

[0042]

[0043] Plating process conditions: the pulse width of the single pulse square wave current is 1ms, the duty cycle is 15%, and the average current density is 0.4A / dm 2 ; The pH is 8.5, the temperature is 20℃, and the plating time is 50min.

Embodiment 3

[0045] The formula of succinimide silver plating bath is as follows:

[0046]

[0047] Plating process conditions: the pulse width of a single pulse square wave current is 2ms, the duty cycle is 10%, and the average current density is 0.5A / dm 2 ; The pH is 9, the temperature is 25℃, and the plating time is 40min.

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PUM

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Abstract

The invention discloses a succinimide silver plating solution and an electroplating method. The succinimide silver plating solution comprises the following components: 10-20g/L silver nitrate and 130-150g/L succinimide by referring silver content, 30-40g/L methylsulfonate by referring methanesulfonic acid radical, 20-30g/L carbonate and 1-2g/L polyethyleneimine by referring carbonate radical. According to the invention, succinimide is taken as a coordination agent, methylsulfonate is selected as an additive for increasing compactness and smoothness of a plating layer, polyethyleneimine is taken as a brightener, so that the plating liquid has good stability, and the plating layer has discolouration resistance and strong weldability.

Description

Technical field [0001] The invention relates to the technical field of silver plating processes, in particular to a succinimide silver plating electroplating solution and an electroplating method. Background technique [0002] With its excellent properties and relatively low cost, metallic silver has become one of the most widely used precious metals. Among all metals, silver has the best conductivity, and its ductility ranks second among all metals. In addition, silver also has good thermal conductivity, light reflectivity, corrosion resistance and welding performance. Therefore, it is in great demand in the fields of electronics and communications. In addition, because of its unique silver-white metallic luster, silver has been used as a decorative layer on high-end household appliances, tableware, jewelry and other handicrafts. However, silver is a precious metal after all, and its actual application cost is relatively high. The content in the crust is only 1×l0. -5 %, so co...

Claims

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Application Information

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IPC IPC(8): C25D3/46C25D5/18C25D5/12
CPCC25D3/46C25D5/12C25D5/18
Inventor 曾雄燕
Owner WUXI XUEJIANG ENVIRONMENT ENG EQUIP
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