Waste printed circuit board wet-type disassembling method
A printed circuit board and printed circuit technology, which is applied in the field of wet dismantling of waste printed circuit boards, can solve the problems of low component integrity, high risk, and low efficiency, and achieve simple final components, high safety, and solution processing simple effect
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Embodiment 1
[0019] First, the PCB was cleaned to remove surface impurities, dried and placed in a pre-configured methanesulfonic acid solution with a concentration of 1.5mol / L, and an appropriate amount of hydrogen peroxide was added to the acidic solution to make the concentration reach 0.8mol / L. Then stir the solution to make it react completely. After the solder on the surface of the PCB is completely dissolved, take out the circuit board and the electronic components at the bottom of the container and rinse them. When the desoldering rate of the solution decreases, add hydrogen peroxide to the solution. Until the solution no longer dissolves the solder, at this time the acid solution is replaced and the metal in the waste acid is electrolytically recovered or used as a plating solution.
Embodiment 2
[0021] First, the PCB was cleaned to remove surface impurities, placed in a pre-configured acid methanesulfonic acid solution with a concentration of 3.5mol / L, and an appropriate amount of hydrogen peroxide was added to the acid solution to make the concentration reach 0.5mol / L, and then Stir the solution to make it react completely. After the solder on the surface of the PCB is completely dissolved, take out the circuit board and the electronic components at the bottom of the container and rinse them. When the desoldering rate of the solution decreases, add hydrogen peroxide to the solution until The solution no longer dissolves the solder, at which point the acid solution is replaced and the metal in the spent acid is electrolytically recovered or used as a plating solution.
Embodiment 3
[0023] First, the PCB was cleaned to remove surface impurities, placed in a pre-configured acid methanesulfonic acid solution with a concentration of 5.0mol / L, and an appropriate amount of hydrogen peroxide was added to the acid solution to make the concentration reach 0.3mol / L, and then Stir the solution to make it react completely. After the solder on the surface of the PCB is completely dissolved, take out the circuit board and the electronic components at the bottom of the container and rinse them. When the desoldering rate of the solution decreases, add hydrogen peroxide to the solution until the solution Solder is no longer dissolved, and the acid solution is replaced at this time and the metal in the spent acid is electrolytically recovered or used as a plating solution.
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