Electroplating liquid and electroplating method of guanidine sulfamate cyanide-free copper plating
A guanidine sulfamate and cyanide-free copper plating technology, which is applied in the field of electroplating copper technology, can solve problems such as poor quality of the plating layer and unsatisfactory performance of the plating solution, and achieve good quality of the plating layer, excellent performance of the plating solution, and high cathodic current efficiency Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0036] The formulation of the electroplating solution is as follows:
[0037]
[0038] Plating process conditions: the pulse width of the single pulse square wave current is 1ms, the duty cycle is 30%, and the average current density is 0.5A / dm 2 ; The pH is 9, the temperature is 60° C., and the electroplating time is 60 minutes.
Embodiment 2
[0040] The formulation of the electroplating solution is as follows:
[0041]
[0042]
[0043] Plating process conditions: the pulse width of the single pulse square wave current is 1ms, the duty cycle is 25%, and the average current density is 0.7A / dm 2 ; The pH is 9.5, the temperature is 55°C, and the electroplating time is 55min.
Embodiment 3
[0045] The formulation of the electroplating solution is as follows:
[0046]
[0047] Plating process conditions: the pulse width of the single pulse square wave current is 2ms, the duty cycle is 20%, and the average current density is 1.0A / dm 2 ; The pH is 10, the temperature is 50°C, and the electroplating time is 50min.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 