Intelligent card module

Abstract

The utility model provides an intelligent card module, comprising a carrier tape and a chip packaging module. The carrier tape comprises a carrier tape insulation base material with the panel provided with a plurality of through holes, wherein the inner wall of each through hole and two end surfaces of the peripheral carrier tape insulation base materials are all provided with a catalyzed printing ink line layer, and the outside of the catalyzed printing ink line layer is provided with a copper line layer to from carrier tape function pads and carrier tap pads of the carrier tap which are conductive; the chip packaging module comprise a chip and a carrier; the function pads of the chip are correspondingly conducting with the function pads of the carrier; the function pads of the carrier are correspondingly conducting with the function pads of the carrier tape. According to the utility model, the chip packaging module and the carrier tape are combined in a welding mode to form an intelligent card module; compared with an intelligent card module prepared by traditional process, the intelligent card module of the utility model has better environmental protection effect and simpler process and generates less waste materials and pollution in production process; in addition, the intelligent card module keeps the performance effect of a traditional intelligent card module, and meanwhile greatly reduces raw material cost, production cost and maintenance cost.

Description

technical field [0001] The invention relates to a packaging technology for microelectronic semiconductors and integrated circuits, in particular to a smart card module. Background technique [0002] With the continuous advancement of integrated circuit packaging technology, the integration level of integrated circuits is increasing day by day, the functions are becoming more and more abundant, and the requirements for product application fields are becoming more and more stringent, which requires integrated circuit packaging enterprises to develop new types of Package form to meet new requirements. [0003] For example, in the field of smart card packaging, the demand for smart cards in domestic and foreign markets is very large. At present, the smart card industry is developing towards the route of technological innovation. New technologies are constantly emerging, and new manufacturing technologies are also increasing. The technology is also continuously improved and stre...

AI Technical Summary

Problems solved by technology

Among them, the smart card carrier tape uses conventional copper-clad boards to etch to produce circuits, and then undergoes electroplating nickel and electroplating gold processes. During the process, a large amount of acid pollutants and waste water will be discharged, which will have a serious impact on the environment.

In addition, the traditional chip is mounted on the smart card carrier tape in the form of a bare chip. The bare chip needs to be used in a clean workshop environment and stored in a nitrogen environment. The production cost and storage cost of the module remain high

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