Intelligent card module

A smart card and functional pad technology, applied in the field of smart card modules, can solve the problems of high production cost and storage cost of smart card modules, discharge of acid pollutants and waste water, inability to solder pads, etc., and achieve high environmental protection effect and low operating cost. The effect of low, continuous performance effect
CN104637902AInactive Publication Date: 2015-05-20上海安缔诺科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
上海安缔诺科技有限公司
Publication Date
2015-05-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

The utility model provides an intelligent card module, comprising a carrier tape and a chip packaging module. The carrier tape comprises a carrier tape insulation base material with the panel provided with a plurality of through holes, wherein the inner wall of each through hole and two end surfaces of the peripheral carrier tape insulation base materials are all provided with a catalyzed printing ink line layer, and the outside of the catalyzed printing ink line layer is provided with a copper line layer to from carrier tape function pads and carrier tap pads of the carrier tap which are conductive; the chip packaging module comprise a chip and a carrier; the function pads of the chip are correspondingly conducting with the function pads of the carrier; the function pads of the carrier are correspondingly conducting with the function pads of the carrier tape. According to the utility model, the chip packaging module and the carrier tape are combined in a welding mode to form an intelligent card module; compared with an intelligent card module prepared by traditional process, the intelligent card module of the utility model has better environmental protection effect and simpler process and generates less waste materials and pollution in production process; in addition, the intelligent card module keeps the performance effect of a traditional intelligent card module, and meanwhile greatly reduces raw material cost, production cost and maintenance cost.
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Description

technical field

[0001] The invention relates to a packaging technology for microelectronic semiconductors and integrated circuits, in particular to a smart card module. Background technique

[0002] With the continuous advancement of integrated circuit packaging technology, the integration level of integrated circuits is increasing day by day, the functions are becoming more and more abundant, and the requirements for product application fields are becoming more and more stringent, which requires integrated circuit packaging enterprises to develop new types of Package form to meet new requirements.

[0003] For example, in the field of smart card packaging, the demand for smart cards in domestic and foreign markets is very large. At present, the smart card industry is developing towards the route of technological innovation. New technologies are constantly emerging, and new manufacturing technologies are also increasing. The technology is also continuously improved and stre...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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