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A kind of preparation method of metal matrix composite electronic package containing high volume fraction sic

A metal-based composite and electronic packaging technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as low strength, reduce sintering temperature, avoid incomplete degreasing, and shorten the production cycle.

Active Publication Date: 2017-03-29
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] 3D printing technology is widely used in various fields and can also be used to prepare SiC preforms. However, the pressure cannot be applied during the 3D printing process, and the SiC particles are only bonded together by laser melting binder. Therefore, compared with using high temperature The SiC preform prepared by high-pressure sintering, the strength of the SiC preform prepared by 3D printing is low, and the mechanical properties of the 3D printing body must be enhanced by subsequent low-temperature multi-stage sintering

Method used

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  • A kind of preparation method of metal matrix composite electronic package containing high volume fraction sic
  • A kind of preparation method of metal matrix composite electronic package containing high volume fraction sic
  • A kind of preparation method of metal matrix composite electronic package containing high volume fraction sic

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Weigh SiC particles with particle sizes of 10 μm, 85 μm, and 145 μm according to the mass ratio of 1:2:7, use 50 μm nylon 3200 powder as the binder, and the ratio of binder to the total mass of SiC particles is 1:5. The SiC particles with multimodal particle size distribution and the binder are mixed and dried, and the obtained mixed powder is used as a raw material for preparing a SiC preform. The SiC volume fraction is designed to be 60%, and the SiC prefabricated body file to be prepared is designed using a general-purpose three-dimensional design software CAD, and the file is imported into the selective laser sintering equipment, arranged in a three-dimensional non-repetitive space, and the slice thickness is determined to be 0.05 mm, The scanning distance is 0.05mm, the laser power is 200W, and the scanning rate is 100mm / s. SLS equipment is used to perform layer-by-layer selective laser sintering on the prepared material until a complete SiC preform is printed. Th...

Embodiment 2

[0053] Weigh SiC particles with particle sizes of 10 μm, 85 μm, and 145 μm according to the mass ratio of 1:2:7, and use 25 μm nylon 3200 powder as a binder; the ratio of binder to the total mass of SiC particles is 1:5, The SiC particles with multimodal particle size distribution and the binder are mixed and dried, and the obtained mixed powder is used as a raw material for preparing a SiC preform. The SiC volume fraction is designed to be 65%, and the SiC prefabricated body file to be prepared is designed using a general-purpose three-dimensional design software CAD, and the file is imported into the selective laser sintering equipment, arranged in a three-dimensional non-repetitive space, and the slice thickness is determined to be 0.1mm, The scanning interval is 0.1mm, the laser power is 200W, and the scanning speed is 100mm / s. SLS equipment is used to perform layer-by-layer selective laser sintering on the prepared material until a complete SiC preform is printed. The pr...

Embodiment 3

[0056] Weigh SiC particles with a particle size of 5 μm, 60 μm, and 145 μm according to the mass ratio of 1:1:8, and use nylon 3200 powder with a particle size of 50 μm as a binder. The ratio of the binder to the total mass of SiC particles is 1: 4. Mix and dry the SiC particles with multi-modal particle size distribution and the binder, and the obtained mixed powder is used as the raw material for preparing the SiC preform. The volume fraction of the SiC porous preform is designed to be 70%, and the SiC preform file to be prepared is designed using a general-purpose three-dimensional design software CAD, and the file is imported into the selective laser sintering equipment, arranged in a three-dimensional non-repetitive space, slice thickness, feeding speed , laser power, scan rate and other parameters are the same as in Embodiment 1, and the FDM (Fused Deposition Modeling) technical parameter settings are initialized. FDM (Fused Deposition Modeling) technology is used to sta...

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Abstract

The invention relates to a preparation method of an electronic packaging device, in particular to a preparation method of a metal matrix composite electronic packaging device containing high-volume-fraction SiC. The preparation method comprises the following steps: taking an adhesive and SiC particles according to the mass ratio of 1: (3-5) and uniformly mixing; after a SiC preform standby material is obtained, obtaining an SiC green body with the set size and shape through a 3D printing technology; successively obtaining an SiC porous preform by adopting a low-temperature multi-segment sintering mode; then performing molten metal impregnation treatment to obtain a finished product. According to the preparation method, the electronic packaging device with any complicated shape can be prepared, the forming process can be controlled with high precision, and the volume fraction SiC, porosity, preform aperture and hole length can be accurately controlled, so that the mechanical property and the thermo-physical property of materials are accurately controlled.

Description

technical field [0001] The invention relates to a method for preparing an electronic package, in particular to a method for preparing a metal matrix composite electronic package containing high volume fraction SiC. Background technique [0002] With the development of microelectronic devices in the direction of high performance, light weight and miniaturization, more and more stringent requirements are put forward for packaging materials. Traditional electronic packaging materials mainly include plastics, metals and their alloys, and ceramics. Plastics have the advantages of low density, good insulation performance, and low cost, but they have disadvantages such as low thermal conductivity, large thermal expansion coefficient, low strength, and poor moisture resistance. And its alloys have good mechanical properties and good heat dissipation performance, but their thermal expansion coefficient is high and their density is high. Ceramics have a low thermal expansion coefficie...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48B22F3/105B33Y10/00B33Y70/00
CPCB22F3/105H01L21/48
Inventor 李红英欧阳勋赖永秋
Owner CENT SOUTH UNIV
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