Unlock instant, AI-driven research and patent intelligence for your innovation.

Preparation method of package bonding wire and finished product thereof

A technology for welding and core material, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problems of increasing process complexity and manufacturing cost, and achieves improved production rate and improved surface area. The effect of flatness

Inactive Publication Date: 2018-06-15
ELECTRIC WIRE & CABLE
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, preparing the bonding wire by this method will increase the complexity of the process and the production cost; and since the skin layer of this patent is also formed on the core material before the wire drawing process, even if the crystal structure and crystal orientation of the skin layer are controlled ratio, it is still impossible to completely avoid the problem of defects or cracks on the surface of the skin layer due to wire drawing processing

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of package bonding wire and finished product thereof
  • Preparation method of package bonding wire and finished product thereof
  • Preparation method of package bonding wire and finished product thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1 to 8

[0040] Embodiments 1 to 8 The preparation method of packaging bonding wire and its finished product

[0041] Examples 1 to 8 were basically prepared through the following methods for preparing bonding wires for packaging, and various bonding wires for packaging were produced.

[0042] First, prepare a base material with a wire diameter of 160 microns. The main component of the base material is oxygen-free copper with a purity of 4N or more (99.99 weight percent (wt%)), and also contains impurities such as iron, manganese, and arsenic. The content is 0.01% by weight.

[0043]Then, at a wire drawing speed of 100 to 150 meters / minute (m / min), use a multiple diamond eye mold with an eye mold area reduction rate of 7% to 9%, and repeat the multi-pass wire drawing process to obtain the Wire-processed base material, and then stretch the aforementioned wire-drawn base material with multiple diamond eye dies with an outlet eye die aperture value between 15 microns and 50 microns, so t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a preparation method of packaging welding wire and its finished product. The preparation method includes: firstly using an eye mold with an appropriate area reduction ratio to process the base material by wire drawing to obtain a core material; then forming an anti-oxidation layer on the core material through an electroplating process; and heat-treating the anti-oxidation layer at an appropriate annealing temperature To obtain package bonding wires suitable for semiconductor packaging processes. According to the present invention, since the preparation method first carries out the wire drawing process and then the electroplating process, the cracks formed on the surface of the core material due to the wire drawing process can be filled by the electroplating process, so that the anti-oxidation layer can be completely covered on the surface of the core material and The surface smoothness of the anti-oxidation layer is improved, so as to solve the problem that the packaging bonding wires in the prior art often reduce the quality of the semiconductor device due to cracks formed in the anti-oxidation layer.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a method for preparing packaging bonding wires and a finished product thereof. Background technique [0002] In order to meet the demand for precision, high-quality, and low-cost products in the semiconductor field, copper wires coated with an anti-oxidation layer are now mostly used instead of gold wires to connect electronic and circuit components, and to form semiconductor devices by packaging. [0003] China Taiwan Patent Announcement No. I287282 discloses an anti-oxidation copper wire. The anti-oxidation copper wire is composed of a copper wire and an anti-oxidation layer coated on the outer surface of the copper wire, so that the copper wire has an anti-oxidation property superior to that of a gold wire. electrical reliability. [0004] China Taiwan Patent Announcement No. 578286 also discloses a connecting wire, which includes a core material with copper as the main componen...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60H01L23/49
CPCH01L24/45H01L2224/45H01L2224/45139H01L2224/45149H01L2224/4516H01L2924/01016H01L2924/00011H01L24/43H01L2224/45664H01L2224/45565H01L2224/45147H01L2924/01049H01L2924/00012
Inventor 吕宗鸿赵健佑
Owner ELECTRIC WIRE & CABLE