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Pressure sensor fixing mechanism

A technology of pressure sensors and fixing mechanisms, which is applied in the direction of conveyor objects, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as low degree of automation, difficulty in ensuring product bonding strength and quality, and inability to improve production efficiency. Achieve the effects of compact structure, solving the instability of pressure control, and simple structure

Inactive Publication Date: 2015-06-03
SUZHOU SECOTE PRECISION ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the product is small and flake-shaped, it brings great troubles to production positioning and assembly. Traditional assembly equipment cannot accurately and quickly absorb and assemble electronic products that are relatively small and flake-shaped, so the degree of automation is not high. The production efficiency cannot be improved, and it is difficult to ensure the bonding strength and quality of the product during the assembly process

Method used

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  • Pressure sensor fixing mechanism

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Embodiment Construction

[0013] The present invention will be further described below in conjunction with accompanying drawing.

[0014] The pressure sensor 8 fixing mechanism includes a cylinder 1, a linear slide rail 2, a fixed plate 3, a peeling pressure head 4, a suction head 5, a fixed guide sleeve 6, a spline 7, a pressure sensor 8, and an elastic member 9, and is characterized in that the cylinder 1 Set on the fixed plate 3, the fixed plate 3 is connected with the spline 7 through the linear slide rail 2, the elastic part 9 is arranged above the spline 7, and the pressure sensor 8 is arranged between the spline 7 and the elastic part 9, and the bottom of the spline 7 The bottom fixed by the fixed guide sleeve 6 has a peeling pressure head 4 , and a suction head 5 is arranged below the peeling pressure head 4 . The elastic member 9 is a compression spring. The section of the fixing plate 3 presents a "Z" shape. The corner of the "Z" shape of the fixed plate 3 section is 90 degrees.

[0015] D...

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Abstract

The invention relates to a pressure sensor fixing mechanism. The pressure sensor fixing mechanism comprises an air cylinder, a linear sliding rail, a fixed plate, a peeling pressure head, a sucker, a fixed guide sleeve, a spline, a pressure sensor and an elastic component. When in use, after a product is sucked and assembled to another product, a pressure spring close to the interior part descends to a certain position, and assembly is started when the pressure reaches a specified standard. According to the pressure sensor fixing mechanism, the instability of pressure control during personnel operation is solved through the utilization of a mechanics principle and according to the characteristics of products, the operation difficulty is reduced to the minimum, the operation time is shortened and the function maximization is realized. Besides, the pressure sensor fixing mechanism adopts a principle that the pressure spring is compressed, is provided with a precision linear bearing inside, is compact in structure, solves the difficulty of personnel manual operation, and is high in speed and efficiency. The pressure sensor fixing mechanism has a simple structure, and can realize material coiling and uncoiling at the same time.

Description

technical field [0001] The invention relates to the field of mechanical manufacturing, in particular to a pressure sensor fixing mechanism. Background technique [0002] Electronic technology is an emerging technology developed at the end of the nineteenth century and the beginning of the twentieth century. It developed the fastest and was most widely used in the twentieth century, becoming an important symbol of the development of modern science and technology. [0003] The first generation of electronic products centered on the electron tube. At the end of the 1940s, the first semiconductor triode was born in the world. With the characteristics of small size, light weight, power saving, and long life, it was quickly used by various countries and replaced electronic tubes in a large range. In the late 1950s, the first integrated circuit appeared in the world, which integrated many transistors and other electronic components on a silicon chip, making electronic products mor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/50H01L21/67H01L21/677
Inventor 孙丰
Owner SUZHOU SECOTE PRECISION ELECTRONICS CO LTD
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