Server cabinet cooling system combined with door type heat pipe air conditioner and liquid cooling device

Abstract

The invention discloses a server cabinet cooling system with combined gate-type heat pipe air-conditioner and liquid cooling device. The system comprises a liquid-cooled server cabinet; the liquid-cooled server cabinet comprises a cabinet body and a plurality of liquid-cooled servers arranged in the cabinet body; the liquid cooling device is arranged to perform direct liquid cooling heat dissipation on the servers; the gate-type heat pipe air-conditioner is further arranged to realize auxiliary heat dissipation. The server cabinet cooling system is high in cooling density, high in heat exchange efficiency, low in energy consumption, capable of solving local heat spots, small in floor area, high in reliability, low in noise and long in service life. A standard server cabinet can be applied to the system.

Description

technical field [0001] The invention relates to a server cabinet cooling system, in particular to a server cabinet cooling system combining a door-type heat pipe air conditioner and a liquid cooling device. Background technique [0002] With the continuous increase of high-density cabinets in the IDC Internet data center computer room, the integration of equipment is getting higher and higher, and the processing capacity is gradually increasing, but the power consumption of the equipment is also increasing, resulting in more heat generated by the equipment in the cabinet. According to statistics, at present, the cabinet servers in large-scale IDC computer rooms in China generate a lot of heat, and basically run 8760h throughout the year. It accounts for about 40%~50% of the overall energy consumption of the data center. [0003] Traditional data room air supply methods include floor air duct air supply, hot and cold aisle isolation air supply, and whole room cooling air sup...

AI Technical Summary

Problems solved by technology

The heat pipe radiator of this patent is only attached to the server, and does not perform the most direct heat dissipation on the main heat-generating device. In addition, the system performs two-loop heat exchange through the intermediate heat exchanger, which is also It is bound to lead to lower heat transfer efficiency than direct heat transfer

In addition, this patent only considers the heat dissipation scheme of the main heating element (CPU) of the server, but does not consider the heat dissipation of other heating elements (memory hard disk, etc.), so the heat dissipation scheme proposed in this patent is not perfect enough.

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