PCB glue removing method in mode of vertically depositing copper wires

Abstract

The invention discloses a PCB glue removing method in the mode of vertically depositing copper wires, and the method is applicable to a PCB manufacturing technology. The method includes the steps of board feeding, expanding, first water washing, first glue refuse removing, second water washing, first neutralizing, third water washing, second expanding, fourth water washing, second glue refuse removing and fifth water washing. According to the method, only a second expanding position and a second glue removing position are added, so that second expanding and second glue refuse removing of high-TG boards can be conducted in a second expanding cylinder and a second glue removing cylinder separately and respectively, the situation that in the prior art, the expanding cylinders are left unused after first glue refuse removing is conducted, and glue removing can be conducted on the next batches of the high-TG boards only after second expanding and second glue refuse removing are conducted can be avoided, glue removing can be conducted on the high-TG boards continuously, due to the fact that the equipment costs of the second expanding cylinder and the second glue removing cylinder are lower, on the basis of the lower equipment cost, the high-TG board glue removing yield is greatly increased, and production efficiency is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of PCB board manufacturing, and in particular relates to a glue removal method for vertically sinking copper wires of a PCB board. Background technique [0002] The production process of multi-layer PCB board is: material cutting→inner layer graphics→inner layer etching→pressing→drilling→immersion copper (including desmear process)→full board electroplating→outer layer graphics→graphic plating→outer layer etching →Solder mask→Character→Surface treatment→Forming→Final inspection→Packaging, among them, the role of sinking copper is to form a conductive copper layer in the hole, so that the layers and interlayer lines are connected to each other, and the hole wall must be cleaned before sinking copper. Desmear process. [0003] Because during the drilling process, the temperature generated by the high-speed rotation of the drill bit and the strong friction of the PCB board is relatively high, and because the g...

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a method for removing glue on vertical copper wires of PCB boards, aiming to solve the problem of lower production efficiency and lower production efficiency of PCB boards with high TG values ​​in the prior art

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