Method for producing microcarriers
A technology of microcarriers and ontology, applied in the field of microcarriers, can solve problems such as separation and error, and achieve the effect of improving mechanical properties and reliable analysis
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[0057] The following will refer to Figures 6 to 17 Methods of making microcarriers according to the invention are described. The method comprises the following sequential steps:
[0058] first step, such as Figure 4 As shown, there is provided a wafer 6 having a sandwich structure, the wafer 6 comprising a bottom layer 7, a top layer 8 and an insulating layer 9 between said bottom layer and top layer 7,8.
[0059] For example, the wafer 6 is an SOI (silicon on insulator) wafer having a bottom layer 7 with a diameter of 100 mm and a thickness of 380 μm, an insulating layer 9 with a thickness of 1 μm and a top layer 8 with a thickness of 10 μm. The top layer 8 and the bottom layer 7 are made of monocrystalline silicon, and the insulating layer 9 is made of silicon dioxide.
[0060] The second step, such as Figure 5 As shown, a photoresist layer 10 is applied on top layer 8 . In order to outline the surface of the microcarriers, the photoresist layer 10 is irradiated with...
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