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Heat-conducting sheet and production method of base plate thereof

A thin sheet and bottom plate technology, which is applied in the field of heat conduction sheet and its bottom plate, can solve the problem that the hardness and mechanical strength of graphite materials are not as good as metal, and the difficulty of heat conduction sheets, so as to achieve the effect of increasing the specific surface area of ​​heat dissipation and reducing the thickness

Active Publication Date: 2015-07-01
厦门烯成石墨烯科技有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

The heat sink based on highly oriented pyrolytic graphite described in this utility model can meet the public's requirements for miniaturization and lightness of heat-conducting sheets of electronic components, but the hardness and mechanical strength of graphite materials are far inferior to metals, and its processing forms thermal conductivity. There is a certain degree of difficulty in the thin film process

Method used

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  • Heat-conducting sheet and production method of base plate thereof
  • Heat-conducting sheet and production method of base plate thereof
  • Heat-conducting sheet and production method of base plate thereof

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Embodiment Construction

[0028] In order to make the purpose, features and advantages of the present invention clearer, the specific implementation of the present invention will be described in more detail below in conjunction with the accompanying drawings and embodiments. In the following description, many specific details are set forth for the convenience of The invention is fully understood, but it can be practiced in many other ways than that described. Accordingly, the present invention is not limited to the specific implementations disclosed below.

[0029] A thermally conductive sheet, such as figure 1 , figure 2 , image 3 shown, including

[0030] A base plate, the base plate 1 is a copper foil 11 grown with a graphene film 12, the base plate 1 is etched with patterned capillary grooves 13, the capillary grooves 13 are cross-linked to form a capillary structure, and the capillary grooves 13 are cross-linked to form a capillary structure. Copper oxide nanowires 14 are also grown on the i...

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Abstract

The invention discloses a heat-conducting sheet. The heat-conducting sheet comprises a base plate and a cove plate. The base plate refers to a copper foil with a grapheme film. Patterned capillary grooves are etched on the base plate. A network structure is formed by cross linking of the capillary grooves. Copper oxide nanowires are grown on the inner walls of the capillary grooves. The cover plate refers to a copper foil with a grapheme film. The cover plate and the base plate are combined oppositely into a sealed cavity. The sealed cavity is filled with a working fluid. The heat-conducting sheet can meet people's requirements on small size, low weight and thinness of heat-conducting sheets of electronic products while solving heat radiation problems of electronic components effectively.

Description

technical field [0001] The invention relates to the technical field of manufacturing heat-conducting sheets of electronic products, in particular to a method for manufacturing a heat-conducting sheet and a bottom plate thereof. Background technique [0002] In recent years, with the wide application of electronic equipment and the rapid development of semiconductor component integration technology, while the requirements for the integration of components are getting higher and higher, the requirements for the volume of components are also becoming smaller and smaller. Light and thin, and the resulting heat dissipation issues are getting more and more attention from the industry. The main reason is that electronic components will generate a lot of heat when they operate at high speed. If they are not dissipated in a timely and effective manner, it will greatly affect the working performance and stability of the components, and at the same time reduce the components to a certa...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 王振中
Owner 厦门烯成石墨烯科技有限公司
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