Method for testing single event effect of on-chip system

Abstract

The invention discloses a method for testing single event effect of an on-chip system. The method includes: dynamically testing single event effect of a register, a high-speed data cache D-cache, an integer operation unit ALU, a floating-point operation unit FPU, direct memory access DMA, an off-chip memory, an on-chip memory and a peripheral unit in a microprocessor of the on-chip system; mainly testing the above function modules dynamically, namely testing occurrence number of single event effect, error data and working current changing condition of the function modules in irradiation environment. By the method, single event effect of different function modules inside the on-chip system can be tested online accurately.

Description

technical field [0001] The invention belongs to the field of single event effect testing, in particular to a system-on-chip single event effect testing method. Background technique [0002] In the space radiation environment of the digital circuit system, due to the radiation effect of cosmic rays and high-energy particles, the semiconductor device of the system may have a single event effect, which seriously affects the reliability, effectiveness and service life of the digital circuit system. The system on chip (SoC) includes different digital circuits, analog circuits, peripheral interfaces and complex bus systems according to its different functional requirements, and it is small in size, light in weight, high in frequency and good in performance, so it is widely used in the aerospace field. certain application value. However, the size of semiconductor devices is getting smaller and the operating voltage is getting lower and lower, which means that single event effects ...

AI Technical Summary

Problems solved by technology

However, the size of semiconductor devices is getting smaller and the operating voltage is getting lower and lower, which means that single event effects are more likely to occur, and the system on chip integrates multiple functional modules on one chip, the error types will be more complicated, and the measurement methods will be more complicated. more complicated

Therefore, there is no unified test method for the single event effect test of the system on chip (SoC)

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