Ultrasonic Vibration Elastic Loading Device for Wire Saw Cutting

Abstract

The invention provides an ultrasonic vibration elastic loading device for wire saw cutting. An elastic ultrasonic vibration table is mounted on a cutting machine working table (a feeding dragging plate), and notches with opposite openings are formed in a connecting part of the elastic ultrasonic vibration table and the working table, so that the yield force of the vibration table is weakened; therefore, the vibration transmission efficiency of a transverse vibration or longitudinal vibration transducer is improved, minimization of the transducer is facilitated, and the power consumption is reduced; meanwhile, the dual-ultrasonic transducer is used for loading longitudinal vibration or transverse vibration to the elastic ultrasonic vibration table, so that the elastic ultrasonic vibration table does forced ultrasonic vibration to drive a workpiece and a consolidated electroplated diamond sand line to do relative vibration, and thus the aim of efficient and high-precision ultrasonic processing is fulfilled.

Description

technical field [0001] The invention belongs to the technical field of cutting devices for hard and brittle materials, and in particular relates to an ultrasonic vibration elastic loading device for wire saw cutting. Background technique [0002] Hard and brittle materials such as single crystal SiC, gemstones, and silicon crystals are widely used in aerospace, electronics, and chemical industries because of their excellent and stable physical and chemical properties. However, due to its hard and brittle characteristics, hard and brittle materials make slicing processing very difficult, and the processing precision is low and the cost is high. Consolidated abrasive diamond wire saw slicing technology has attracted more and more attention due to its advantages such as narrow kerf, high material removal rate, good slicing quality and clean cutting environment. However, the difficulty of its processing is well known. Chinese patent ZL03133682.5 and Chinese patent CN20101056521...

AI Technical Summary

Problems solved by technology

However, the difficulty of its processing is well known. Chinese patent ZL03133682.5 and Chinese patent CN201010565214 both add ultrasonic waves to the wire saw. Although the cutting efficiency and wafer precision are improved compared with those before adding ultrasonic waves, the stroke of the wire saw in patent ZL03133682.5 Too short, the wire saw needs to be replaced continuously during the cutting process, the effective cutting time is short, and it cannot be used in actual production. The patent CN201010565214 ultrasonic head is in direct contact with the wire saw. When the diamond wire saw cuts the workpiece, the ultrasonic head also cuts. , on the one hand, the life of the wire saw is shortened, on the other hand, the ultrasonic energy is quickly attenuated until it disappears

The above two processing methods increase the processing cost and reduce the efficiency

Chinese patent ZL200610044360.7 and Chinese patent CN103158204A respectively load ultrasonic waves on the workbench or the workpiece to generate resonance to realize ultrasonic wire saw compound cutting. These two loading methods can effectively solve the defects caused by the above two loading methods, but the patent ZL200610044360 .7 Fix the workpiece on the workbench, and drive the workbench with ultrasonic waves, so that the workbench drives the workpiece to vibrate ultrasonically during cutting to achieve the purpose of ultrasonic wire saw compound cutting. The disadvantage is that the ultrasonic wave must drive the workbench, fixtures and workpieces Resonate together, the ultrasonic load is too heavy, and it is difficult for the ultrasonic transducer to achieve a good acoustic match with it; second, during the cutting process, the quality or shape of the workpiece continues to change, and the natural frequency of the cutting system also changes, and its own frequency has exceeded the transducer. The resonant frequency range of the transducer is even difficult to make the transducer start to vibrate, so it is difficult to achieve the resonance state between the transducer and the workbench in practical applications

However, the patent CN103158204A has the following disadvantages: one is to directly load the ultrasonic waves on the workpiece, which will cause more cracks on the wafer surface and subsurface for hard and brittle materials such as SiC single crystals, resulting in increased subsequent grinding allowances, The material waste is serious and the yield is low; the second is that the contact surface that is directly attached to the contact surface of the workpiece is required, and the ultrasonic emitting surface has the same length as the object to be cut, which makes it possible to make special ultrasonic heads for workpieces of different shapes. The third is that the ultrasonic frequency is required to be kept at or close to the resonance frequency of the cutting system, which requires continuous adjustment of the cutting frequency during the cutting process to ensure smooth cutting. The work is too cumbersome

The above defects restrict the application of this slicing technology in cutting hard and brittle materials. Therefore, it is necessary to propose an improved

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