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Laser eutectic soldering device and method

A eutectic welding and laser technology, used in laser welding equipment, welding equipment, printed circuits, etc., can solve problems such as low temperature, circuit metal loss, adhesion, etc., to ensure accuracy, ensure uniformity and accuracy, and adjust real-time adjustment. fast temperature effect

Active Publication Date: 2015-08-19
北京中科镭特电子有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermal damage will affect the performance of thin-film devices; high humidity may cause adhesion, wear, and adhesion; ineffective thermal components will affect heat conduction
The most common problem when eutectic is that the temperature of the base is lower than the eutectic temperature. In this case, the solder can still melt, but there is not enough temperature to diffuse the gold plating layer on the back of the chip, and the operator is easy to mistake the solder melting. Eutectic
On the other hand, heating the base for too long can lead to loss of circuit metal

Method used

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  • Laser eutectic soldering device and method
  • Laser eutectic soldering device and method
  • Laser eutectic soldering device and method

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Embodiment Construction

[0059] The present invention is described in detail below in conjunction with accompanying drawing:

[0060] figure 1 A schematic diagram showing the laser eutectic welding device and method of the present invention. The laser eutectic welding device is composed as follows: laser 1, used to emit laser beam 2; laser beam shaping system 3, to make the laser beam with Gaussian distribution into a flat top beam with uniform energy density distribution; concave lens 51 and convex lens 52 cooperate to realize beam expansion Collimation function, the expanded and collimated laser beam is incident on the laser focusing mirror 5, and cooperates with the laser beam shaping system 3 to match the size of the laser spot irradiated on the eutectic welding base 7 with the size of the eutectic welding chip ; Under the action of vacuum generator and gas pipe 22, suction nozzle 10 picks up and places eutectic welding solder 8 and eutectic welding chip 9 on eutectic welding base 7, and eutectic...

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Abstract

The invention discloses a laser eutectic soldering device and method. A substrate which needs eutectic soldering is placed on a base station, and the place for holding the eutectic soldering substrate is hollowed; a suction nozzle picks eutectic soldering flux and a chip which needs eutectic soldering and places on the substrate by the aid of a vacuum generator and an air pipe thereof, and a certain pressure is exerted to the eutectic soldering chip when performing eutectic soldering; light beams emitted from a laser emit to a light beam shaping system, and Gaussian distribution laser beams are shaped into flat-top beams; a concave lens and a convex lens fitly expand and collimate the laser beams, and then the laser beams are emitted to a laser focusing mirror; an obliquely arranged beam combiner reflects the laser emitted from the laser to enable the laser to irradiate the substrate which needs eutectic soldering; laser emitted from a laser thermodetector passes through the beam combiner to irradiate the substrate which needs eutectic soldering to monitor the temperature of the substrate and feed back to the laser in real time, and the energy of the laser emitted from the laser is controlled in real time to realize a precise temperature curve.

Description

technical field [0001] The invention belongs to the technical field of laser eutectic welding, relates to a laser eutectic welding device and a method thereof, and is especially suitable for chips and electronic devices sensitive to temperature. Background technique [0002] In hybrid integrated circuits, there are currently two main methods for mounting semiconductor chips on carrier devices such as substrates, stems, and assemblies: one is bonding with silver paste conductive adhesive, and the other is welding. Compared with conductive adhesive bonding, eutectic bonding has the advantages of high thermal conductivity, small resistance, fast heat transfer, strong reliability, and large shear force after bonding. It is suitable for chips and substrates in high-frequency and high-power devices. , The interconnection between the substrate and the shell. For power devices with higher heat dissipation requirements, eutectic soldering must be used. Eutectic welding uses the pro...

Claims

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Application Information

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IPC IPC(8): B23K26/21B23K26/70B23K101/42
CPCB23K26/20
Inventor 张彪易飞跃李俊
Owner 北京中科镭特电子有限公司
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