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A method for fixing flexible material substrates by using photoresist

A flexible substrate and flexible material technology, applied in the field of microelectronics, can solve the problems of bending and curling of flexible materials, and achieve the effect of solving air bubbles and ensuring flatness

Active Publication Date: 2016-11-16
JILIN JIANZHU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention relates to a method for fixing a flexible material substrate by using a photoresist to solve the problem that the flexible material will bend and curl during the process of growing a thin film material and preparing a device

Method used

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  • A method for fixing flexible material substrates by using photoresist
  • A method for fixing flexible material substrates by using photoresist
  • A method for fixing flexible material substrates by using photoresist

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] (1) Select a flat hard substrate and a flexible substrate, the hard substrate material is quartz plate 1, 50mm*50mm, the flexible substrate 2 material is polyimide PI, 20mm*20mm, for The hard substrate and the flexible substrate are cleaned separately, as follows:

[0021] (1) Put the hard substrate or flexible substrate into acetone solution and ultrasonically clean them for 4 minutes at room temperature to remove surface molecular contamination;

[0022] (2) Then place them in ethanol solution and ultrasonically clean them for 3 minutes at room temperature to remove residual acetone on the surface;

[0023] (3) Ultrasonic cleaning with deionized water at room temperature for 3 minutes to remove residual ethanol and ionic contamination;

[0024] (4) Blow dry with high-purity nitrogen, and dry in a drying oven at 90°C for 3 minutes;

[0025] (2) Substrate bonding, fix the hard substrate quartz plate on the homogenizer, drop photoresist 3, 0.2ml, in the middle of the q...

Embodiment 2

[0027] (1) Select a flat hard substrate and a flexible substrate, the hard substrate material is quartz plate 1, 50mm*50mm, the flexible substrate 2 material is polyimide PI, 20mm*20mm, for The hard substrate and the flexible substrate are cleaned separately, as follows:

[0028] (1) Put the hard substrate or flexible substrate into acetone solution and ultrasonically clean them for 5 minutes at room temperature to remove surface molecular contamination;

[0029] (2) Then place them in ethanol solution and ultrasonically clean them for 4 minutes at room temperature to remove residual acetone on the surface;

[0030] (3) Ultrasonic cleaning with deionized water at room temperature for 4 minutes to remove residual ethanol and ionic contamination;

[0031] (4) Blow dry with high-purity nitrogen, and dry in a drying oven at 90°C for 4 minutes;

[0032] (2) Substrate bonding, fix the hard substrate quartz plate on the homogenizer, drop photoresist 3, 0.35ml in the middle of the q...

Embodiment 3

[0034] (1) Select a flat hard substrate and a flexible substrate, the hard substrate material is quartz plate 1, 50mm*50mm, the flexible substrate 2 material is polyimide PI, 20mm*20mm, for The hard substrate and the flexible substrate are cleaned separately, as follows:

[0035] (1) Put the hard substrate or flexible substrate into acetone solution and ultrasonically clean them for 6 minutes at room temperature to remove surface molecular contamination;

[0036] (2) Then place them in ethanol solution and ultrasonically clean them for 5 minutes at room temperature to remove residual acetone on the surface;

[0037] (3) Ultrasonic cleaning with deionized water at room temperature for 5 minutes to remove residual ethanol and ionic contamination;

[0038] (4) Blow dry with high-purity nitrogen, and dry in a drying oven at 90°C for 5 minutes;

[0039] (2) Substrate bonding, fix the hard substrate quartz plate on the homogenizer, drop photoresist 3, 0.5ml in the middle of the qu...

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Abstract

The invention relates to a method for fixing a flexible material substrate by using photoresist, belonging to the technical field of microelectronics. Select a flat hard substrate and a flexible substrate, clean, dry, and dry. The hard substrate material is a quartz sheet, and the flexible substrate material is polyimide PI, ethylene terephthalate Alcohol ester PET, or polypropylene hexadiene PPA; substrate bonding, the hard substrate and the flexible substrate are better bonded and fixed by using an adhesive material, and the substrate adhesive material is photoresist. The invention solves the problem of bending and warping of the flexible substrate material in the technological process, and at the same time solves the problem of air bubbles between the substrates. It ensures the flatness of the flexible substrate during the growth of functional materials and device preparation, and can be applied in technical fields such as flexible wearable electronics, flexible displays, flexible sensors, and flexible solar cells.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and in particular relates to a method for fixing a flexible material substrate by using a photoresist PR. Background technique [0002] As technologies such as flexible wearable electronics, flexible displays, flexible sensors, and flexible solar cells have gradually become a new generation of forward-looking technologies, flexible materials as substrates are more and more widely used in the field of microelectronics technology. Related semiconductor thin films based on flexible materials Research work on material growth and synthesis, semiconductor device fabrication, etc. has been developed rapidly. [0003] Flexible materials as substrates are mainly divided into five categories: plastics, metal foils, ultra-thin glass and paper substrates, and biocomposite film substrates. Among them, plastics are considered to have broad prospects as flexible substrates, because plastic substrates ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/00H10K99/00
CPCH10K71/80H10K77/111Y02E10/549
Inventor 杨小天王超高晓红赵春雷郭亮迟耀丹初学峰常玉春朱慧超杨佳吕卅王锐任伟
Owner JILIN JIANZHU UNIVERSITY