Method and device for measuring heat conductivity of quasi-one-dimensional conductive material

A technology of conductive materials and thermal conductivity, which is applied in the field of measuring the thermal conductivity of quasi-one-dimensional conductive materials, can solve the problems of difficult measurement and large thermal conductivity deviation, and achieve the effect of simple and convenient installation

Active Publication Date: 2015-09-02
INST OF PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The purpose of the present invention is to provide a more simple, convenient, low-cost and efficient method and device for measuring the thermal conductivity of quasi-one-dimensional conductive materials, so as to

Method used

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  • Method and device for measuring heat conductivity of quasi-one-dimensional conductive material
  • Method and device for measuring heat conductivity of quasi-one-dimensional conductive material
  • Method and device for measuring heat conductivity of quasi-one-dimensional conductive material

Examples

Experimental program
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Embodiment 1

[0088] Utilize the measurement method and the device of quasi-one-dimensional conductive material thermal conductivity of the present invention to measure the thermal conductivity of platinum wire fiber, concrete steps and measurement result are as follows:

[0089] 1) Fix the platinum wire to the test sample stage:

[0090] see figure 1 and figure 2 The schematic diagram and top view of the test sample platform are shown. The platinum wire sample 2 is fixed on the four copper electrodes 121-124 in the sample table 1 with high-purity silver glue, and the four silver glue fixing points 141-144 keep the platinum wire in good electrical and thermal contact with the heat sink. The middle section of the sample is suspended in the air, and the copper electrode is connected to four lead wires 131-134 for measuring the resistance of the suspended section in the middle of the sample by the four-electrode method to avoid the influence of contact resistance.

[0091] 2) Obtain platin...

Embodiment 2

[0102] The method and device for measuring the thermal conductivity of a quasi-one-dimensional conductive material of the present invention are used to measure the thermal conductivity of a red copper film.

[0103] 1) Fix the red copper thin film to the test sample platform, and the specific operation is the same as step 1) in Example 1.

[0104] 2) Obtain the size information of the copper film:

[0105] The thickness H was measured with a surface topography instrument. Under an optical microscope, measure the length L and width W of the middle suspended segment. Take the average value of multiple measurements L=19.2mm, W=1.03mm, H=20μm, and the corresponding cross-sectional area S=W×H.

[0106] 3) Load the sample platform to the sample chamber, the specific operation is the same as step 3) of Example 1.

[0107] 4) Measure the rate of change B of the resistance of the copper film suspended section with temperature.

[0108] Concrete operation is with the step 4) of embo...

Embodiment 3

[0113] The thermal conductivity of the copper fiber at 400K is measured by the method and device for measuring the thermal conductivity of the quasi-one-dimensional conductive material of the present invention.

[0114] 1) Fix the red copper fiber to the test sample platform, and the specific operation steps are the same as step 1) in Example 1.

[0115] 2) Obtain the size information of the copper fiber:

[0116] Under an optical microscope, measure the length L and diameter D of the middle suspended segment. Take the average value of multiple measurements L=19.8mm, D=134μm.

[0117] 3) Load the sample platform to the sample chamber, the specific operation steps are the same as step 3) of Example 1.

[0118] 4) Measure the change rate B of the resistance of the copper fiber suspension section with temperature.

[0119] Concrete operation steps are with embodiment 1 step 4). Fit a series of temperature and resistance values ​​obtained from the records into an R-T curve, an...

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Abstract

The invention discloses a method and a device for measuring the heat conductivity of a quasi-one-dimensional conductive material. The method comprises the following steps: putting the quasi-one-dimensional conductive material with the length L and the cross section S of a suspended section into a T0 environment; applying current I and heating by the suspended section to achieve heat balance; measuring R of the suspended section at the heat balance by using working current; changing the current I to obtain a plurality of Rs corresponding to the different currents I of the suspensed section; carrying out linear fitting of I2 and 1/R on the plurality of currents I and the plurality of corresponding Rs; obtaining a change rate k and an intercept 1/R0 of the 1/R along the I2 according to the result so as to obtain a resistance value R0 when the suspended section does not have the heat effect; and determining the appearance heat conductivity lambda' of the suspended section under the T0 according to the length L and the cross section S of the suspended section, the inclined slope k, the resistance value R0 and a linear change rate B of the resistance R along the temperature T. The method is simple and convenient, cheap and efficient, and can be applied to the measurement of the heat conductivity of micro-nano conductive fibers and conductive thin films.

Description

technical field [0001] The invention relates to the technical field of thermal conductivity measurement, in particular to a method and device for measuring the thermal conductivity of a quasi-one-dimensional conductive material. Background technique [0002] Thermal conductivity, also known as thermal conductivity, is one of the most basic and important thermophysical parameters reflecting the thermal conductivity of materials. In engineering heat transfer, heat insulation and other application fields, it is particularly important to select materials with suitable thermal conductivity. Therefore, it is very necessary to accurately measure the thermal conductivity of various materials, which has important guiding significance for evaluating and improving the thermal properties of different materials. [0003] At present, the methods for measuring the thermal conductivity of bulk materials are relatively mature, mainly including steady-state heat flow method and laser pulse m...

Claims

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Application Information

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IPC IPC(8): G01N25/20
Inventor 周文斌范庆霞王艳春周维亚解思深
Owner INST OF PHYSICS - CHINESE ACAD OF SCI
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