Semiconductor laser tube core sintering clamp and sintering method thereof

Abstract

The invention discloses a semiconductor laser tube core sintering clamp and a sintering method thereof. The clamp comprises a base, fixation columns and a pressure block. The fixation columns are fixed on the base, the base is at least provided with a group of fixation columns, each group comprises two fixation columns, the two fixation columns of each group are provided with the pressure block, and the pressure block is provided with two guide holes and are sleeved on the fixation columns through the two guide holes. The sintering method comprises the following steps: (1), arranging laser tube cores and heat sinks on the two fixation columns of each group of the fixation columns; (2), placing the pressure block on the two fixation columns of each group, enabling the pressure block to apply pressure on the tube cores, and enabling the pressure block to be compacted right opposite to laser tube cores; and (3), carrying out sintering. The semiconductor laser tube core sintering clamp is simple in structure, low in cost and simple to operate, can be conveniently placed in a nitrogen protective cover casing, effectively prevents a solder from oxidation in high-temperature sintering, can realize rapid batch sintering of the tube cores and the heat sinks of semiconductor lasers, and is high in production efficiency.

Description

technical field [0001] The invention relates to a sintering method and a fixture for semiconductor laser tube cores, belonging to the technical field of semiconductor laser tube core sintering. Background technique [0002] With the advancement of science and technology and the development of society, the application of lasers in various fields has gradually expanded. In particular, emerging semiconductor lasers have the advantages of small size, light weight, high electro-optical conversion efficiency, long life and high reliability, and have gradually replaced the traditional gas and solid-state lasers in the application market, and are widely used in industrial processing, medical treatment, and display. , entertainment, communications and security and other fields. Due to the small size and high power characteristic of the semiconductor laser tube core, it is not conducive to the heat dissipation of the tube core. The waste heat generated by the tube core needs to be...

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that only one laser can be sintered at a time, which is not suitable for batch sintering; and there are many parts in the whole device, it is difficult to process and assemble the precision parts required, and the manufacturing cost is high

The disadvantage of this method is that there are many parts in the whole device, it is difficult to process the fine parts required, and the manufacturing cost is high

During the repeated heating and cooling process in production, the parts are prone to deformation, which makes the fixture unusable

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