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LED lamp housing, manufacturing method and manufacture die thereof

A technology of LED lamp housing and manufacturing method, which is applied in the direction of manufacturing tools, forging/pressing/hammering machinery, and damage prevention measures for lighting devices, which can solve the problems of complex process and high processing cost, and achieve simple process and good heat dissipation effect , Improve the effect of cooling efficiency

Inactive Publication Date: 2015-09-09
SHENZHEN BETOP ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Its shortcomings are also obvious. It is necessary to cut out the required heat dissipation fins with a shearing machine, and then weld the fins to form the fins. The process is complicated and the processing cost is high.

Method used

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  • LED lamp housing, manufacturing method and manufacture die thereof
  • LED lamp housing, manufacturing method and manufacture die thereof
  • LED lamp housing, manufacturing method and manufacture die thereof

Examples

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Effect test

Embodiment 1

[0046] 1) Prepare the aluminum cake: Calculate the material consumption of the aluminum cake according to the structure of the product blank, and use "material weight = product blank volume * material density * (1+ material loss ratio)" to estimate; in this embodiment, pure aluminum AL1070 is used is a material with a density of 2.7g / cm 3 , the loss ratio is 5-8%. Calculate the size of the aluminum cake according to the external dimensions of the product, wherein, the diameter of the aluminum cake = the outer diameter of the product + the machining allowance, and the thickness of the aluminum cake = the amount of material / the area of ​​the bottom of the blank / the density of the material; According to the product blank structure, design the one-time molding blank structure;

[0047] 2) One-time forming blank: place the aluminum cake blank in the first accommodation cavity 51 of the first lower mold 5, lower the first punch 3, pressurize the aluminum cake blank by 368 tons, and ...

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Abstract

The invention discloses an LED lamp housing, a manufacturing method and a manufacture die thereof. The LED lamp housing comprises a lamp head portion, a heat-radiating portion and a connecting plate used for fixing an LED light source. The connecting plate is arranged between the lamp head portion and the heat-radiating portion. The lamp head portion is provided with a cavity used for installing the LED light source and a reflection cup. The heat-radiating portion is internally provided with a heat-radiating assembly formed by parallel arrangement of multiple heat-radiating fins. A linear ventilating slot is formed between every two adjacent heat-radiating fins. An annular ventilating slot is formed between the heat-radiating assembly and the inner wall of the LED lamp housing. The manufacturing method of the LED lamp housing mostly comprises one-time cold-forging and second-time cold-forging. By adoption of the LED lamp housing produced by utilizing the manufacturing method and the manufacture die, the size of the lamp housing can be increased to the maximum extent so that integrated structuration of the heat-radiating portion and the lamp head portion is achieved. Therefore, heat resistance between the heat-radiating portion and the lamp head portion is decreased so that heat is uniformly radiated and higher heat-radiating efficiency is obtained; and a product is low-weighted so as to be suitable for large-batch production.

Description

technical field [0001] The invention relates to the technical field of LED lighting equipment, in particular to an LED lamp housing, a manufacturing method thereof, and a manufacturing mold. Background technique [0002] The heat dissipation problem is one of the important technical bottlenecks of LED lighting, because 90% of the input electric energy must be converted into heat energy to be discharged, and the LED grain is a semiconductor material, which cannot withstand high temperature (<120°C), and if the lamp uses a fan to assist heat dissipation , not only need to provide power to the fan, which will increase the cost and consume power, but also the structure of the lamp body is complex, and the appearance and optical design of the lamp need to be considered. Therefore, LED lighting technology is a highly complex technology. At present, the heat dissipation of LED lamps Mainly rely on the LED lamp housing. [0003] At present, there are mainly extrusion technology,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V15/02F21V29/507F21V29/76F21V29/89B21J5/02B21J13/02F21Y101/02
CPCF21V15/02B21J5/02B21J13/02
Inventor 刘月平秦俊谭昭君
Owner SHENZHEN BETOP ELECTRONICS CO LTD
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