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A kind of crystal-bonding glue for LED, preparation method of crystal-bonding glue and LED lamp

A crystal-bonding adhesive and graphene technology, applied in the direction of light source fixing, lighting and heating equipment, adhesive additives, etc., can solve the problem of only 25W/(M·K, etc., to improve the stability and reliability of LED, reduce the Internal stress, the effect of improving chip voltage

Active Publication Date: 2017-05-17
太湖县市场监督检验所(太湖县功能膜检测研究院)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

al 2 o 3 The same is true for chips with the same brightness. The size of the LED light source is getting smaller and smaller, and the current density is getting higher and higher. The power of the light source is gradually popularized from the original 0.06W to the current 1W, 3W, 5W, and even outdoor street lights The integrated light source is 200-300W, which puts forward higher requirements on the performance of thermally conductive material die-bonding adhesives. At present, silver glue is a very mature die-bonding adhesive, and the thermal conductivity of its main component silver is 500W / (M·K). The silver powder content has reached 90%, but it is used as a crystal-bonding glue, and its thermal conductivity is currently only 25W / (M·K)

Method used

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  • A kind of crystal-bonding glue for LED, preparation method of crystal-bonding glue and LED lamp
  • A kind of crystal-bonding glue for LED, preparation method of crystal-bonding glue and LED lamp
  • A kind of crystal-bonding glue for LED, preparation method of crystal-bonding glue and LED lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0057] 1. The material composition and metering formula of the crystal-bonding adhesive in this example are shown in Table 1.

[0058] Table 1 Components and dosage of crystal-bonding glue

[0059] main ingredient Key Technical Indicators Parameters Dosage (g) High-purity modified graphene Thermal conductivity 5300W / (M K), purity 99.97%, particle size (D 50 )10-100nm

30 polysiloxane Kinematic viscosity 50000-500000cSt, particle size (D 50 )0.1-10μm

7.8452 fatty acid (LCFA) Kinematic viscosity 5.0-50.0cSt, particle size (D 50 )1~50μm

1.1768 platinum catalyst Kinematic viscosity 5.0-50.0cSt, purity 99.8%, particle size (D 50 )0.1-10.0μm

0.0078 Tackifying Rosin Resin Kinematic viscosity 5.0-50.0cSt, particle size (D 50 )1-50μm

0.1961

[0060] 2. Preparation method of crystal-bonding glue

[0061] 1) Weighing materials: Weigh each component according to the composition and dosage in Table 1, and place it...

Embodiment 2

[0070] 1. The material composition and metering formula of the crystal-bonding adhesive in this example are shown in Table 3.

[0071] Table 3 Components and dosage of crystal-bonding glue

[0072] main ingredient Key Technical Indicators Parameters Dosage (g) High-purity modified graphene Thermal conductivity 5300W / (M K), purity 99.97%, particle size (D 50 )10-100nm

30 polysiloxane Kinematic viscosity 50000-500000cSt, particle size (D 50 )0.1-10μm

5.6611 Aliphatic amides (EBS) Kinematic viscosity 5.0-50.0cSt, particle size (D 50 )1~50μm

1.6983 platinum catalyst Kinematic viscosity 5.0-50.0cSt, purity 99.8%, particle size (D 50 )0.1-10.0μm

0.0038 Silicone modified rosin resin Kinematic viscosity 5.0-50.0cSt, particle size (D 50 )1-50μm

0.3774

[0073] 2. Preparation method of crystal-bonding glue

[0074] 1) Weighing materials: Weigh each component according to the composition and dosage in Table 3, ...

Embodiment 3

[0083] 1. The material composition and metering formula of the crystal-bonding glue in this example are shown in Table 5.

[0084] Table 5 Components and dosage of crystal-bonding glue

[0085] main ingredient Key Technical Indicators Parameters Dosage (g) High-purity modified graphene Thermal conductivity 5300W / (M K), purity 99.97%, particle size (D 50 )10-100nm

30 polysiloxane Kinematic viscosity 50000-500000cSt, particle size (D 50 )0.1-10μm

10.2389 Esters (HTG) Kinematic viscosity 5.0-50.0cSt, particle size (D 50 )1~50μm

0.6143 platinum catalyst Kinematic viscosity 5.0-50.0cSt, purity 99.8%, particle size (D 50 )0.1-10.0μm

0.0205 Hydrogenated Rosin Resin Kinematic viscosity 5.0-50.0cSt, particle size (D 50 )1-50μm

0.0819

[0086] 2. Preparation method of crystal-bonding glue

[0087] 1) Weighing materials: Weigh each component according to the composition and dosage in Table 5, and place it in a ...

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Abstract

The invention discloses an adhesive for an LED (light emitting diode), an adhesive preparation method and an LED lamp. Graphene is innovatively added in the adhesive for the LED. Since the added graphene is high in heat conduction coefficient, good in insulation property, excellent in temperature resistance, good in thermal stability and high in refractive index, the heat conductivity of the prepared adhesive is greatly improved. By adopting the adhesive, not only is the heat conductivity high, but also the processing capacity of a heat flow passage inside an LED chip can be improved, the accumulation of heat flow of the chip and internal stress among materials can be reduced, and the interface temperature and heat resistance can be realized; moreover, the light source electricity leakage defect of the chip caused by the adhesive can be prevented, the light emitting efficiency of the chip can be improved, the service life of the LED is prolonged, and the stability and reliability of the LED can be improved; a foundation is set for preparing a high-power LED light source.

Description

technical field [0001] The present application relates to the field of LED thermal interface materials, in particular to a crystal-bonding adhesive for LEDs, a preparation method thereof, and an LED lamp using the crystal-bonding adhesive. Background technique [0002] On October 7, 2014, the Royal Swedish Academy of Sciences awarded the 2014 Nobel Prize in Physics to the Japanese scientists Isamu Akasaki and Hiroshi Amano who invented the "high-brightness blue light-emitting diode (LED)", and the Japanese-American scientist Shuji Nakamura. In recognition of their contributions to the discovery of new types of efficient and environmentally friendly light sources. The Royal Swedish Academy of Sciences said when announcing the list of winners, "The emergence of LED lights has enabled us to find a longer-lasting and more energy-saving light source than traditional light sources. This invention has opened up a lighting revolution, and incandescent bulbs have illuminated 20 cent...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J11/04H01L33/56F21S2/00F21V19/00F21Y115/10
Inventor 赵大成汪雄伟
Owner 太湖县市场监督检验所(太湖县功能膜检测研究院)