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A semi-floating gate memory structure and manufacturing method thereof

A semi-floating gate and memory technology, applied in semiconductor devices, electric solid state devices, electrical components, etc., can solve the problems of slow reading speed of semi-floating gate memory, affecting the performance of semiconductor devices, etc., to achieve simple structure and improve reading and writing speed. Effect

Active Publication Date: 2018-09-25
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when semi-floating gate transistors manufactured according to the prior art are applied to low-voltage ultrafast memory (Low-voltage Ultrafast Memory) and sensors (Sensing Operation), the reading speed of semi-floating gate memory is slow, which will affect the performance of semiconductor devices

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  • A semi-floating gate memory structure and manufacturing method thereof
  • A semi-floating gate memory structure and manufacturing method thereof
  • A semi-floating gate memory structure and manufacturing method thereof

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Embodiment Construction

[0025] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0026] In order to thoroughly understand the present invention, detailed steps will be presented in the following description to illustrate how the present invention improves the process of fabricating semiconductor device structures to solve the problems in the prior art. Obviously, the practice of the invention is not limited to specific details familiar to those skilled in the semiconductor arts. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments besides these detailed descr...

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Abstract

The invention discloses a semi-floating gate memory structure and a manufacturing method thereof. A gate dielectric layer located on a semiconductor substrate; a floating gate contact area located in the gate dielectric layer; and a gate dielectric layer located on the gate dielectric layer. A semi-floating gate, the semi-floating gate includes a first semi-floating gate and a second semi-floating gate; an isolation dielectric layer located on the surface and side of the semi-floating gate; a control gate located on the second half-floating gate; first spacers located on both sides of the control gate; second spacers located on both sides of the isolation dielectric layer that is not covered with the control gate; wherein the second half-floating gate completely covers the Floating gate contact area, the control gate wraps the second half floating gate. The semi-floating gate memory structure and implementation method prepared according to the present invention will improve the reading and writing speed of the memory. The structure of the semi-floating gate memory is simple, and it is helpful to realize the function of the semi-floating gate memory in the MOSFET transistor.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semi-floating gate memory structure and an implementation method. Background technique [0002] Semiconductor memories are widely used in various electronic products. Different application areas place different requirements on the structure, performance and density of semiconductor memories. For example, static random access memory (SRAM) has high random access speed and low integration density, while standard dynamic random access memory (DRAM) has high density and medium random access speed. [0003] Metal-oxide-semiconductor field-effect transistors (MOSFETs) and floating-gate transistors are the most basic devices in integrated circuits today. With the advancement of semiconductor device manufacturing technology, the size of transistors has been shrinking, and their power density has been increasing. The shrinking size of semiconductor devices will in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/11521H10B41/30H10B69/00
Inventor 康劲卜伟海王文博
Owner SEMICON MFG INT (SHANGHAI) CORP