Room temperature curing one-component filling type electric conductive sealant

A conductive sealant, room temperature curing technology, applied in the field of sealant, to achieve the effect of small resistivity, good solvent resistance and excellent mechanical properties

Inactive Publication Date: 2015-09-23
青岛泰联科高分子材料研发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Nowadays, there is a big gap between domestic conductive adhesives and foreign countries in terms of variety and performance.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Specific formula:

[0021] Toluene: 8%; hydroxyl-terminated polydimethylsiloxane: 45%; metal additives: 46%, wherein the ratio of silver powder to copper powder is 0.045; dibutyltin dilaurate: 1%.

[0022] Preparation method: (1) disperse hydroxyl-terminated polydimethylsiloxane in toluene, uniformly dispersed mixed solution; (2) add metal additives to the mixed solution of step (1), and disperse evenly with a high-speed disperser (3) Add dibutyltin dilaurate to the mixed solution in step (2), and disperse evenly with a high-speed disperser to obtain a room temperature curing one-component filled conductive sealant.

[0023] After experimental testing, the conductive adhesive prepared in the above example meets the volume resistivity: 1.03×10 -6 Ω·m, tensile strength: 1.6MPa, surface dry time: 10-20min.

Embodiment 2

[0025] Specific formula:

[0026] Toluene: 8%; hydroxyl-terminated polydimethylsiloxane: 45%; metal additives: 45%, wherein the ratio of silver powder to copper powder is 0.045; dibutyltin dilaurate: 2%.

[0027] Preparation method: (1) disperse hydroxyl-terminated polydimethylsiloxane in toluene, uniformly dispersed mixed solution; (2) add metal additives to the mixed solution of step (1), and disperse evenly with a high-speed disperser (3) Add dibutyltin dilaurate to the mixed solution in step (2), and disperse evenly with a high-speed disperser to obtain a room temperature curing one-component filled conductive sealant.

[0028] After experimental testing, the conductive adhesive prepared in the above example meets the volume resistivity: 1.03×10 -6 Ω·m, tensile strength: 1.6MPa, surface dry time: 10-20min.

Embodiment 3

[0030] Specific formula:

[0031] Toluene: 8%; hydroxyl-terminated polydimethylsiloxane: 46.5%; metal additives: 45%, wherein the ratio of silver powder to copper powder is 0.045; dibutyltin dilaurate: 0.5%.

[0032] Preparation method: (1) disperse hydroxyl-terminated polydimethylsiloxane in toluene, uniformly dispersed mixed solution; (2) add metal additives to the mixed solution of step (1), and disperse evenly with a high-speed disperser (3) Add dibutyltin dilaurate to the mixed solution in step (2), and disperse evenly with a high-speed disperser to obtain a room temperature curing one-component filled conductive sealant.

[0033] Through the experimental test, the conductive adhesive prepared in the above embodiment meets the volume resistivity: 1.03×10 -6 Ω·m, tensile strength: 1.6MPa, surface dry time: 10-20min.

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Abstract

The invention relates to the field of sealant, in particular to the room temperature curing one-component filling type electric conductive sealant. The room temperature curing one-component filling type electric conductive sealant is composed of methylbenzene, hydroxy-terminated polydimethylsiloxane, a metal additive and a curing agent. The metal additive is the mixture of silver powder and copper powder, wherein the proportion of the silver powder to the copper powder is 0.045-0.05. The room temperature curing one-component filling type electric conductive sealant has the advantages that the volume resistivity is small, the mechanical property is excellent, the property is stable, and the performance of thermostability and solvent resistance is good. According to the room temperature curing one-component filling type electric conductive sealant, the hydroxy-terminated polydimethylsiloxane, the sliver powder and the copper powder are taken as the main raw materials, in addition, the curing agent is added into the mixture for fully mixing, the finished product made of the sealant has the advantages that the weather resistance is good, the electrical property is stable, the curing can be achieved at the room temperature, and the phenomenona of color changes and insulation deterioration can not occur after the product is used for a long time. The room temperature curing one-component filling type electric conductive sealant is widely applied to the fields needing high-reliability electric conductive bonding such as electronics, communication, automobiles and medical equipment.

Description

technical field [0001] The invention relates to the field of sealants, in particular to a room temperature curing one-component filled conductive sealant. Background technique [0002] Conductive adhesive is an adhesive with a certain conductivity after curing or drying. It usually uses matrix resin and conductive fillers, namely conductive particles, as the main components. The conductive particles are combined through the bonding effect of the matrix resin to form a conductive adhesive. Pathway to realize the conductive connection of the adhered material. Since the matrix resin of the conductive adhesive is an adhesive, an appropriate curing temperature can be selected for bonding. At the same time, due to the miniaturization and miniaturization of electronic components and the rapid development of high density and high integration of printed circuit boards, conductive adhesives can be made into pastes to achieve high line resolution. Moreover, the conductive adhesive ha...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/06C09J9/02C09K3/10
Inventor 张威
Owner 青岛泰联科高分子材料研发有限公司
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