Die-bonding substrate and method for flip chip
A wafer and flip-chip technology, applied in the fields of electrical solid-state devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as unguaranteed yield, increased bubbles, and flip-chip leakage. Achieve the effect of eliminating chip leakage, increasing the heat dissipation rate, and reducing the occurrence of air bubbles
Inactive Publication Date: 2015-09-23
GUANGDONG LCLED LIGHTING
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Problems solved by technology
[0002] At present, the flip chips in the prior art generally use silver glue to fix the crystal. Since silver glue is a conductive material, it is easy to climb the glue when it is cured at high temperature, and the positive and negative electrodes of the flip chip are turned on, causing a short circuit and leakage. , increasing the occurrence of bubbles, causing leakage of flip chip, and the yield rate cannot be guaranteed
Moreover, the heat dissipation of the flip-chip is slow, the heat dissipation performance is not good, and the heat dissipation cannot meet the highest requirements, which affects the performance of the overall product, etc.
Method used
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Embodiment 1
[0017] A substrate for flip-chip die-bonding described in Example 1, such as figure 1 As shown, a ceramic substrate 1 is included, and a circuit, a circuit and a gold channel are arranged on the ceramic substrate, an insulating glue 2 is arranged on the crystal bonding area of the ceramic substrate, and a flip chip 3 is fixed on the insulating glue. The loaded chip is wrapped by silver glue 4 and the flip-chip is solidified.
[0018] The silver glue is fixed on the front and back of the ceramic substrate to wrap the flip-chip, and the silver glue arranged on the front and back of the ceramic substrate is elliptical.
[0019] The insulating glue is silica gel, and the silver glue is high thermal conductivity silver glue.
[0020] In addition, any one or more of resin and silicone resin can also be used as the insulating glue in the above embodiments. Or use thermally conductive adhesive instead of insulating adhesive. The thermally conductive adhesive is any one or more of ...
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The invention discloses a die-bonding substrate for a flip chip, and the substrate comprises a ceramic substrate. The ceramic substrate is provided with a circuit, a circuit, and a gold channel. A die-bonding region of the ceramic substrate is provided with insulating glue or thermal conduction glue, and the flip chip is disposed on the insulating glue or thermal conduction glue in a die-bonding manner. The insulating glue or thermal conduction glue and the flip chip are wrapped by silver colloid or solder paste, and the flip chip is arranged in a die-bonding manner. The center of a functional region of the ceramic substrate is provided with an insulating glue or thermal conduction glue layer at first, and the silver colloid is employed for die bonding after the insulating glue or thermal conduction glue is solidified. The objective is to isolate the circuits of the substrate, to avoid glue climbing during high-temperature solidifying, and to avoid the electric leakage of a wafer. When the above scheme is employed for die-bonding operation, the substrate and method can prevent the short circuit of die-bonding silver colloid from causing electric leakage, reduce bubbles, and increase heat-dissipation speed of the wafer, thereby guaranteeing quality, and improving yield. Moreover, the flip chip generated through the above scheme is better in heat-dissipation performance.
Description
technical field [0001] The invention relates to the technical field of flip-chip crystal bonding, in particular to a flip-chip crystal-bonding substrate that adopts insulating colloid such as insulating glue or heat-conducting glue and then uses silver glue to solidify the crystal. Background technique [0002] At present, the flip chips in the prior art generally use silver glue to fix the crystal. Since silver glue is a conductive material, it is easy to climb the glue when it is cured at high temperature, and the positive and negative electrodes of the flip chip are turned on, causing a short circuit and leakage. , increase the occurrence of air bubbles, and cause leakage of flip chip, and the yield rate cannot be guaranteed. Moreover, the heat dissipation speed of the flip chip is slow, the heat dissipation performance is not good, and the heat dissipation cannot meet the highest requirements, which affects the performance of the overall product. Contents of the invent...
Claims
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Login to View More IPC IPC(8): H01L23/498H01L23/367H01L23/373H01L21/48H01L21/60
Inventor 周建华
Owner GUANGDONG LCLED LIGHTING