Two-level copper removing technology for treating low-concentration comprehensive wastewater in PCB electroplating

A comprehensive wastewater, low-concentration technology, applied in metallurgical wastewater treatment, water/sewage multi-stage treatment, water/sludge/sewage treatment, etc., can solve the problems of floating sludge in sedimentation tanks, affecting normal wastewater discharge, etc. The effect of drug cost

Inactive Publication Date: 2015-09-30
湖南景翌湘台环保高新技术开发有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the sedimentation tank will produce a large amount of copper-containing sludge, which will easily cause the sedimentation tank to float and affect the normal discharge of subsequent wastewater.

Method used

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  • Two-level copper removing technology for treating low-concentration comprehensive wastewater in PCB electroplating
  • Two-level copper removing technology for treating low-concentration comprehensive wastewater in PCB electroplating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A secondary copper removal process for treating low-concentration comprehensive wastewater from PCB electroplating, including secondary copper removal processes: the first-level copper removal removes hydrated copper ions in the wastewater, and the second-level copper removal removes complex copper ions. The process includes the following steps:

[0028] (1) The first stage of copper removal: use a lift pump to introduce the comprehensive wastewater into the PH adjustment tank, add liquid caustic soda to the wastewater through the pump and stir evenly with a mixer, adjust the pH to 8.5, use a PH meter for measurement, and then introduce the fast In the mixing tank, add polyaluminum chloride PAC according to the amount of 25kg / 1000 cubic meters of waste water and stir evenly with a mixer, then introduce into the slow mixing tank, add polyacrylamide PAM according to the amount of 2kg / 1000 cubic meters of waste water and stir evenly with a mixer, and then introduce The first-...

Embodiment 2

[0031] A secondary copper removal process for treating low-concentration comprehensive wastewater from PCB electroplating, including secondary copper removal processes: the first-level copper removal removes hydrated copper ions in the wastewater, and the second-level copper removal removes complex copper ions. The process includes the following steps:

[0032] (1) The first stage of copper removal: use a lift pump to introduce the comprehensive wastewater into the PH adjustment tank, add flake caustic soda to the wastewater through the pump and stir evenly with a mixer, adjust the pH to 8.7, use a PH meter for measurement, and then introduce the fast In the mixing tank, add polyaluminum chloride PAC according to the amount of 25kg / 1000 cubic meters of waste water and stir evenly with a mixer, then introduce into the slow mixing tank, add polyacrylamide PAM according to the amount of 2kg / 1000 cubic meters of waste water and stir evenly with a mixer, and then introduce The first-l...

Embodiment 3

[0035] A secondary copper removal process for treating low-concentration comprehensive wastewater from PCB electroplating, including secondary copper removal processes: the first-level copper removal removes hydrated copper ions in the wastewater, and the second-level copper removal removes complex copper ions. The process includes the following steps:

[0036] (1) The first stage of copper removal: use a lift pump to introduce the comprehensive wastewater into the PH adjustment tank, add lime to the wastewater through the pump and stir evenly with a mixer, adjust the pH to 9.0, use a PH meter for measurement, and then introduce fast mixing In the tank, add polyaluminum chloride PAC according to the amount of 25kg / 1000 cubic meters of waste water and stir evenly with a mixer, and then introduce the slow mixing tank, add polyacrylamide PAM according to the amount of 2kg / 1000 cubic meters of waste water and stir evenly with a mixer, and then introduce another Grade sedimentation ta...

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Abstract

The invention discloses a two-level copper removing technology for treating low-concentration comprehensive wastewater in PCB electroplating. The two-level copper removing technology comprises a two-level copper removing process: hydrated copper ions in wastewater are removed in a primary cooper removing process; complex cooper irons are removed in a secondary cooper removing process. The two-level copper removing technology specifically comprises the following steps: after being lifted, the wastewater enters a pH adjustment tank; through pumping, an alkaline chemical agent is added to control the pH value of the wastewater to be 8.5-9; the adjusted wastewater I enters a quick mixing tank and a slow mixing tank in sequence; clear water obtained through primary precipitation is lifted through pumping and enters a complex breaking tank; a proper amount of ferrous sulfate is added for complex breaking; the pH value of the primarily treated wastewater is adjusted to be 8-9; the adjusted wastewater II enters the quick mixing tank and the slow mixing tank in sequence; the wastewater subjected to secondary precipitation enters a pH call-back tank for biochemical treatment; the standard wastewater is discharged. The two-level copper removing technology has the advantages that the chemical agent treatment cost is reduced, the discharged water quality is stabilized, the sludge minimization and the recovery value resource utilization are facilitated, and a high popularization value is achieved for wastewater treatment in the conventional PCB industry.

Description

Technical field [0001] The invention relates to a process for treating electroplating wastewater, in particular to a secondary copper removal process for treating low-concentration comprehensive wastewater from PCB electroplating. Background technique [0002] PCB industry wastewater is mainly produced by the wet process of PC board, such as: inner layer brushing, inner layer development, inner layer etching, inner layer film removal, electroplating, chemical EDTA and other processes. The chemical liquid of each wet process unit uses a variety of chemical raw materials, and various aging high-concentration waste tank liquids and low-concentration cleaning wastewater are discharged during the production process. The composition of wastewater from circuit board production is complex and the concentration gap is large. The wastewater mainly contains Cu 2+ , Ni 2+ , COD, acid, alkali, EDTA complex ion and other pollution components, if not effectively treated, it will cause serious ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/14C02F103/16
Inventor 刘宜德金建安
Owner 湖南景翌湘台环保高新技术开发有限公司
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