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Method for rolling copper-aluminum double-layer composite plate

A composite plate and composite slab technology, applied in the direction of metal rolling, metal rolling, manufacturing tools, etc., can solve the problems of large residual stress, low degree of mechanization, and uneven surface of copper-aluminum double-layer composite panels, and achieve the elimination of Differences in plastic deformation of metals, improved composite rate, and simple process effects

Active Publication Date: 2015-10-07
TAIYUAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

At present, copper-aluminum double-layer medium-thick composite panels are mainly produced by explosive composite method. Although the explosively composited copper-aluminum double-layer composite panels have good bonding performance, their mechanization degree is low, the working conditions are poor, and they are dangerous. The copper-aluminum double-layer composite board produced at the same time has the disadvantages of large residual stress and uneven surface

Method used

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  • Method for rolling copper-aluminum double-layer composite plate
  • Method for rolling copper-aluminum double-layer composite plate
  • Method for rolling copper-aluminum double-layer composite plate

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Embodiment 1

[0030] Embodiment 1: The preparation of L3 aluminum plate-T2 copper plate double-layer medium-thick composite plate has the following steps.

[0031] Blank making: select copper plate 1 and aluminum plate 2 in the homogenized annealed state according to the ratio of 4:1 to form blanks, the size of copper plate 1 is thickness 5mm*width 1000mm*length 2000mm; the size of aluminum plate 2 is thickness 20mm*width 1000mm*length 2000mm; copper plate 1 with 10% H 2 SO 4 Solution soaking and drying, aluminum plate 2 is soaked and dried with 5% NaOH solution; use a wire brush to clean the composite surface of copper plate 1 and aluminum plate 2 until the metal base is seen; stack copper plate 1 and aluminum plate 2 and press them , use a drilling machine to drill two holes symmetrically in the width direction of the rolling bite end. In the width direction, the distance between the holes and the symmetrical line is 350mm, and in the rolling direction, the distance from the slab bite en...

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Abstract

The invention discloses a method for manufacturing a copper-aluminum double-layer medium-thick composite plate through a cold rolling manner. The method comprises following steps: 1) cleaning an aluminum plate and a copper plate in an immersion manner, removing oil of the plates, drying the plates, and cleaning the composite surfaces of the plates; 2) stacking and compressing the copper plate and the aluminum plate, and riveting the plates at a rolling bite end; 3) rolling the copper-aluminum composite plate blank through a two-roller roughing mill; 4) rolling the copper-aluminum composite plate through a three-roller intermediate mill; 5) rolling the copper-aluminum composite plate through a four-roller finishing mill; 6) rolling the copper-aluminum composite plate through a six-roller finishing mill to reach the required thickness; and 7) annealing the copper-aluminum composite plate. According to the invention, rolling is carried out through the rolling mills provided with working rolls having different roll diameters, so that the plastic deformation is increased, the composite ratio is improved, and a plate shape problem of the copper-aluminum double-layer medium-thick composite plate is solved as the working rolls are different in linear speed.

Description

technical field [0001] The invention belongs to the technical field of preparation of copper-aluminum double-layer composite boards, and in particular relates to a method for producing copper-aluminum double-layer medium-thick composite boards by cold rolling. Background technique [0002] Copper and aluminum are the most commonly used conductive materials in the power and electrical industry, and they are also commonly used heat exchange materials in the world. In terms of conductivity, copper has advantages over aluminum, but the density of copper is 8.9 grams per cubic centimeter, which is higher than that of aluminum (2.7 grams per cubic centimeter. cubic centimeters), which means that the number of aluminum products of the same weight is much greater than that of copper products. In terms of heat transfer, the instantaneous heat absorption capacity of copper is 1.6 times faster than that of aluminum, but the heat dissipation speed is relatively slow. In addition, my count...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21B1/38
CPCB21B1/38B21B47/02B21B2001/386
Inventor 黄庆学张将朱琳周存龙李玉贵马立峰高翔宇
Owner TAIYUAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
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