Organic composition for forming ultra-thin copper foil release layer and preparation and application thereof

Abstract

The invention discloses an organic composition for forming an ultra-thin copper foil release layer. The raw materials include deionized water, a phytic acid compound, an alkali solution and a thiadiazole-based compound / thiatriazole-based compound. The mass concentration of the phytic acid compound in the organic composition is 0.01-21g / L, and the mass concentration of the thiadiazole-based compound / thiatriazole-based compound in the organic composition is 0.01-5g / L. The invention is capable of surface adsorption onto a copper foil of a carrier to form a release layer, so that the subsequent electrolytically deposited ultra-thin copper foil can have stable releasability. Compared with benzotriazole, the invention can enable the ultra-thin copper foil to have more stable releasability, have little impact on the conductivity of the electrolytic deposition process, and well solve the contradictions of weak adsorption resulting in difficult release and strong adsorption resulting in poor conductivity. The invention also discloses a preparation method and application method of the above organic composition for forming the ultra-thin copper foil release layer.

Description

technical field [0001] The invention relates to the technical field of copper foil peeling layers, in particular to an organic composition for forming an ultra-thin copper foil peeling layer, preparation and application thereof. Background technique [0002] With the development of high integration and miniaturization of electronic products, the carrier-supported peelable copper foil, which is the main raw material of printed circuit boards (PCBs), is also developing in a thinner and thinner direction. The carrier ultra-thin copper foil below 12 μm is also more difficult to prepare as the thickness is thinner, so ultra-thin copper foil will become the focus of future research on electrolytic copper foil technology and the focus of market demand. [0003] The thinner the copper foil, the more difficult it is to prepare, and it is easy to wrinkle and tear during transportation, so ultra-thin preparation requires high technical content. At home and abroad, the traditional prod...

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Problems solved by technology

[0004] In the process of preparing ultra-thin copper foil, the peeling layer is very important. The peeling layer is mainly divided into: inorganic peeling layer, organic peeling layer and composite peeling layer. The inorganic peeling layer is mainly a metal layer or alloy layer; the organic peeling layer is containing Nitrogen compounds, sulfur-containing compounds and carboxylic acids, etc., often use benzotriazole (BTA) and carboxybenzotriazole (CBTA), etc., and the organic peeling layer often has poor conductivity, resulting in less organic matter adsorption and difficult to peel off, more adsorption Disadvantages of poor conductivity; the composite peeling layer often uses an organic layer and an alloy layer as the peeling layer, and the alloy layer contains rare earth metals, and the price is relatively high

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