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Method for preparing multilayer ceramic capacitor

A technology of multilayer ceramics and capacitors, which is applied in the direction of laminated capacitors, fixed capacitor parts, fixed capacitor dielectrics, etc., and can solve the problems of increasing dust on the production site, unfavorable environmental protection and sanitation.

Active Publication Date: 2015-10-21
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] For the above-mentioned sintering consistency problem, this field usually adopts buried powder sintering method to solve, but buried powder sintering method will increase the dust degree of the production site, which is not conducive to environmental protection and sanitation

Method used

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  • Method for preparing multilayer ceramic capacitor
  • Method for preparing multilayer ceramic capacitor
  • Method for preparing multilayer ceramic capacitor

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Embodiment Construction

[0032] The preparation method of the multilayer ceramic capacitor will be further described in detail below mainly in conjunction with the accompanying drawings.

[0033] combine figure 1 , figure 2 , image 3 and Figure 4 , the preparation method of the multilayer ceramic capacitor of an embodiment, comprises the steps:

[0034] S10, uniformly mix the starch, the first binder and the first solvent to obtain a release slurry, and then use the release slurry as a raw material to prepare a release film 10 .

[0035] In this embodiment, the operation of uniformly mixing the starch, the first binder, and the first solvent is: uniformly mixing the starch, the first binder, and the first solvent by ball milling, and the ball milling time may be 3 hours to 4 hours.

[0036] In the isolation slurry, the mass ratio of the starch, the first binder and the first solvent is 10:2-3:13-15.

[0037] The starch can be cornstarch, the first binder can be acrylic resin, and the first sol...

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Abstract

The invention discloses a method for preparing a multilayer ceramic capacitor. The method includes the steps that an isolation thin film is prepared; ceramic thin films are prepared; the ceramic thin films are stacked, and a first substrate is obtained; the ceramic thin films on which inner electrode patterns are printed are prepared; the ceramic thin films on which the inner electrode patterns are printed are stacked, a stacking unit is obtained, the ceramic thin films are stacked on the two sides of the stacking unit respectively, and a second substrate is obtained; the first substrate, the isolation thin film and the second substrate are sequentially stacked and then laminated, and a third substrate is obtained; the third substrate is cut, and the second substrate is completely cut off to form multiple stacked bodies; adhesion removal and sintering are conducted on the third substrate, and the stacked bodies are sintered into a ceramic body; the ceramic body is separated and then chamfered, and two outer electrodes are attached to the two ends of the ceramic body. According to the method for preparing the multilayer ceramic capacitor, in the sintering process, sintering additives in the first substrate volatilize, so that the local atmosphere with high volatilization concentration is formed around the stacked bodies, and the sintered ceramic body is uniform, compact and good in uniformity.

Description

technical field [0001] The invention relates to the field of electronic components, in particular to a preparation method of a multilayer ceramic capacitor. Background technique [0002] Copper inner electrode multilayer ceramic capacitors use copper with high conductivity as the inner electrode material, which has extremely low equivalent series resistance and is suitable for high frequency applications. In the preparation process of copper inner electrode multilayer ceramic capacitors, the sintering temperature of the ceramic dielectric material co-fired with the copper inner electrode cannot be higher than the melting point of copper, 1083 ° C, so generally more sintering aids are added than other ceramic materials. So that the ceramic dielectric material co-fired with the copper inner electrode can be sintered densely at a temperature lower than the melting point of copper. However, since the sintering aids tend to volatilize easily during high-temperature sintering, th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/622H01G4/30H01G4/12
Inventor 陆亨廖庆文祝忠勇
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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