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Electrical connection interface for connecting electrical leads for high-speed data transmission

A high-speed data transmission and connection interface technology, which is applied in the direction of assembling printed circuits with electrical components, electrically connecting printed components, and structural connections of printed circuits, etc., can solve the problem of reducing signal integrity, signal line crosstalk and other effects that are no longer adequate Effectively eliminate such problems and achieve the effect of small impedance matching

Active Publication Date: 2018-08-31
TYCO ELECTRONICS SVENSKA HLDG +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The size of this board-to-board interconnect can be quite significant, typically 1200µm per differential signal pair, considering that current reflow soldering techniques allow a minimum 200µm spacing between solder beads and limit bead width to 200µm
[0008] However, due to this, crosstalk and other effects between signal lines that degrade signal integrity are no longer sufficiently effectively eliminated

Method used

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  • Electrical connection interface for connecting electrical leads for high-speed data transmission
  • Electrical connection interface for connecting electrical leads for high-speed data transmission
  • Electrical connection interface for connecting electrical leads for high-speed data transmission

Examples

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Embodiment Construction

[0046] now refer to figure 1 , a first advantageous embodiment of an electrical connection interface 100 according to the invention is shown.

[0047] figure 1 Only the metal parts, that is, the signal leads and the ground plane layer, are shown in order to explain the gist of the present invention. However, of course, insulating layers are present, and moreover, the metal layers shown need not necessarily be the only electrically conductive layers. For example, each printed circuit board may contain embedded active and passive components, and also more than two circuit boards may be stacked and interconnected by more than one electrical connection interface 100 .

[0048] According to the basic embodiment of the present invention (such as figure 1 ), the electrical connection interface 100 is used to connect two printed circuit boards (PCBs). A first substrate (not shown in the figure) carries two pairs of first electrically conductive leads. On a substrate (not shown in...

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Abstract

The invention relates to an electrical connection interface for connecting electrical leads for high-speed data transmission, comprising a first substrate carrying at least one first electrically conductive lead (102, 102') and at least one first ground plane layer (106, 106'), The electrically conductive lead has an interface region connected to at least one second electrically conductive lead (104, 104'). The second substrate carries at least one second electrically conductive lead having an interface region connected to the at least one first electrically conductive lead and at least one second ground plane layer (108, 108'). The electrically conductive leads are arranged on an adjacent surface of the substrate. The ground plane layers (106, 106', 108, 108') are electrically insulated from the respective conductive leads and are arranged to at least partially overlap each other.

Description

technical field [0001] The invention relates to an electrical connection interface for connecting electrical leads for high-speed data transmission. The present invention is particularly focused on board-to-board interconnects. Background technique [0002] Due to high data rates in recently developed communication systems having data transfer rates of eg 25 Gbps, signal integrity, such as reduction of crosstalk between signal lines, becomes a major concern. [0003] Ideally, the interconnect system will carry the signal without distortion. One type of distortion is known as crosstalk. Crosstalk occurs when one signal creates an undesired signal on other signal lines. Generally, crosstalk is caused by electromagnetic coupling between signal lines. Therefore, crosstalk is an exclusive problem of high speed, high density interconnect systems. Electromagnetic coupling increases when signal lines are brought close together or when the signals they carry are of higher freque...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/36H05K1/11
CPCH05K1/0225H05K1/0253H05K1/11H05K3/368H05K1/0245H05K2201/09827H05K1/0218H05K1/028H05K1/0306H05K1/09H05K1/14
Inventor A.凯科嫩D.拉皮多特L.伦德奎斯特L-G.斯文森
Owner TYCO ELECTRONICS SVENSKA HLDG