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Cylindrical cu-ga alloy sputtering target and manufacturing method thereof

A technology of sputtering target material and manufacturing method, which is applied in the field of cylindrical Cu-Ga alloy sputtering target material, can solve problems such as cracking and difficult manufacturing methods, and achieve the effect of small fluctuation and high density

Active Publication Date: 2017-03-22
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0020] The above-mentioned methods for producing cylindrical sputtering targets are effective as long as they are made of generally good processability materials, but Cu-Ga alloys used in CIGS-based solar cells form fragile compounds, so it is difficult to Produced by the manufacturing method described in the above-mentioned patent documents
[0021] In addition, when a cylindrical sputtering target is manufactured by a method of manufacturing a flat Cu-Ga alloy sputtering target, problems such as cracking due to stress load also arise.

Method used

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  • Cylindrical cu-ga alloy sputtering target and manufacturing method thereof
  • Cylindrical cu-ga alloy sputtering target and manufacturing method thereof
  • Cylindrical cu-ga alloy sputtering target and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0103] In Example 1, first, the powder manufacturing process was performed. In the powder manufacturing process, in order to produce a cylindrical Cu-Ga alloy sputtering target, the starting material Ga is 25% by mass and the balance is Cu, and the mixture is melted and cast to obtain Cu-Ga alloy. Ingot. After that, the ingot was pulverized by a disc mill and classified to obtain Cu-Ga alloy powder. The average particle size of the classified Cu-Ga alloy powder is 90μm, and the tap density is 5.0g / cm 3 .

[0104] Next, a molding process is performed. In the molding process, in order to mold the produced Cu-Ga alloy powder with CIP, the rubber mold is filled with Cu-Ga alloy powder and processed at a pressure of 250 MPa to obtain a Cu-Ga alloy molded body.

[0105] Next, the HIP process is performed. In the HIP process, first, in order to sinter the Cu-Ga alloy molded body by hot isostatic pressing (HIP), the upper and lower covers, outer frames, and hollow cylinders are made by...

Embodiment 2

[0114] In Example 2, in the powder manufacturing process, Ga as a starting material is 25% by mass and the balance is Cu, blended and melted, produced by gas atomization, and classified to obtain Cu-Ga alloy powder. The average particle size of the classified Cu-Ga alloy powder is 45μm, and the tap density is 6.2g / cm 3 .

[0115] Next, in the HIP process, the Cu-Ga alloy powder was tapped while filling between the inner tube and the outer frame of the sheath produced in the same manner as in Example 1. As a result, the filling density was 8.6g / the specific gravity of the Cu-Ga alloy. cm 3 It is 71.8%. After that, it is degassed from the degassing pipe while heating, and the upper cover is crimped and welded to seal the sheath (refer to figure 2 ).

[0116] Next, the HIP treatment was performed in the same manner as in Example 1 to obtain a Cu-Ga alloy sintered body. Then, in order to confirm the occurrence of cracks and cracks caused by the HIP treatment, a radiation transmissio...

Embodiment 3

[0120] In Example 3, in the powder manufacturing process, Ga as the starting material was 25% by mass and the balance was Cu, and the mixture was melted and cast to obtain a Cu-Ga alloy ingot. After that, the ingot was pulverized with a disk mill and classified to obtain Cu-Ga alloy powder. The average particle size of the classified Cu-Ga alloy powder is 90μm, and the tap density is 5.0g / cm 3 .

[0121] Next, in the forming step, a Cu-Ga alloy molded body was obtained in the same manner as in Example 1.

[0122] Next, in the HIP process, a steel plate having a thickness of 1.0 mm was used to produce a sheath in the same manner as in Example 1.

[0123] Next, the Cu-Ga alloy molded body was filled between the inner tube of the sheath and the outer frame, and then the Cu-Ga alloy powder was tapped while filling. As a result, the filling density was 8.6g / cm relative to the specific gravity of the Cu-Ga alloy. 3 It is 65.2%. After that, it is heated and degassed from the degassing pip...

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Abstract

A cylindrical Cu-Ga alloy sputtering target having no cracks or breaks, and having no variation in relative density or Ga concentration. Hot isostatic pressing is used; a Cu-Ga alloy powder or a Cu-Ga alloy molded body is filled in to a cylindrical capsule (1) such that the filling density is at least 60%, the capsule (1) having a thickness of at least 1.0 mm and less than 3.5 mm; the capsule (1) is hot isostatically pressed; and a Cu-Ga alloy sintered body is obtained.

Description

Technical field [0001] The present invention relates to a cylindrical Cu-Ga alloy sputtering target used in the formation of a light absorption layer of a CIGS (Cu-In-Ga-Se quaternary alloy) solar cell and a manufacturing method thereof. This application claims priority on the basis of Japanese Patent Application No. Japanese Patent Application No. 2013-012023 filed in Japan on January 25, 2013, and is incorporated into this application by referring to this application. Background technique [0002] In recent years, as one of the clean energy sources, solar power generation has attracted attention, and solar cells with crystalline Si are mainly used. Due to supply and cost issues, among thin-film solar cells, CIGS (Cu-In- Ga-Se quaternary alloy) solar cells have attracted attention and have been put into practical use. [0003] The CIGS-based solar cell has as a basic structure: a Mo electrode layer as a back electrode formed on a soda lime glass substrate, and a Cu-In-Ga-Se quate...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/34B22F3/15C22C1/04C22C9/00
CPCC22C1/0425B22F3/15B22F5/10C22C9/00C23C14/3414
Inventor 高桥辰也山岸浩一
Owner MITSUI MINING & SMELTING CO LTD
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