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Photosensitive composition excellent in light absorption and suitable for forming fine pattern

A technology of photosensitive composition and photosensitive resin, which is applied to photosensitive materials used in opto-mechanical equipment, photo-engraving process of pattern surface, optics, etc., can solve the problems such as time-consuming and production efficiency decline, and achieve excellent absorbance Effect

Inactive Publication Date: 2015-11-04
KCC CORP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with the one-shot exposure method, which is a full-surface exposure method, it takes more time and has the disadvantage of lowering productivity
In the above two photolithography methods, different light sources are used in terms of exposure wavelength and intensity, so it is difficult to realize their characteristics with the same solder resist

Method used

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  • Photosensitive composition excellent in light absorption and suitable for forming fine pattern
  • Photosensitive composition excellent in light absorption and suitable for forming fine pattern
  • Photosensitive composition excellent in light absorption and suitable for forming fine pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6 and comparative example 1～3

[0066] The components shown in the following Table 1 were prepared and stirred in the amounts shown in Table 1, and dispersed with a three-roll mill to obtain the photosensitive compositions of Examples 1-6 and Comparative Examples 1-3, respectively.

[0067] Table 1

[0068]

[0069]

[0070] The following evaluation was performed about the soldering resist film formed from the photosensitive composition of each Example and the comparative example prepared above.

[0071] Absorbance

[0072] After coating the photosensitive composition on a high-transmittance optical glass plate, it was dried at 80° C. for 30 minutes in a hot-air circulation oven to obtain a glass plate-shaped dry coating film sample. Absorbance was measured for the prepared dried coating film samples. As a UV-VIS spectrophotometer, Varian's Cary50conc product was used, and the absorbance with respect to the glass plate before coating was set as a baseline. Absorbance charts measured for the compos...

Embodiment 7

[0081] Dilute the photosensitive composition of Example 1 with methyl ethyl ketone, apply the diluted product on the carrier film, and pass through 2 minutes at 60°C, 2 minutes at 80°C, 2 minutes at 110°C, and 2 minutes at 60°C. The temperature distribution was performed for 3 minutes to form a dry coating film with a thickness of 25 μm, and a cover film was attached thereon to obtain a dry film. Thereafter, the cover film was peeled off, and the film was bonded to a patterned copper foil substrate by thermal lamination, followed by exposure by the exposure method listed in Table 2. Thereafter, after removing the carrier film, it was developed with a 1% by weight aqueous solution of sodium carbonate for 90 seconds to obtain a pattern, and heat-cured in a hot air dryer at 150° C. for 60 minutes to obtain a test substrate. The undercut evaluation as described above was performed by observing the substrate in cross section, and the results were the same as those obtained in Examp...

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Abstract

The invention relates to a photosensitive composition excellent in light absorption and suitable for forming a fine pattern, in particular to a photosensitive composition, a cured material thereof and a dry film. Through a disposable exposure method for performing exposure through an ultraviolet lamp and a light mask or a direct description method utilizing light from an ultraviolet lamp or short-wavelength lasers, the photosensitive composition which is used for forming the cured part of the expected pattern and applies the uncured part of the expected pattern to developing through an alkaline aqueous solution is formed. The dry film is obtained by coating a carrier film with the composition and then performing drying. Preferentially, when the drying film coating thickness of the photosensitive composition before exposure is 25 micrometers, the light absorbency for light with the wavelength of 355 nm-375 nm is 1.2-1.8, and the light absorbency for light with the wavelength of 405 nm is above 0.6.

Description

technical field [0001] The present invention relates to a photosensitive composition excellent in light absorption and suitable for forming fine patterns. A direct drawing method of a wavelength laser to form a cured part for realizing a desired pattern, and a photosensitive composition in which an uncured part is used for development by an alkaline aqueous solution, relates to a photosensitive composition and its cured product, and is obtained by A dry film obtained by coating the composition on a carrier film and then drying it. Preferably, the absorbance of the photosensitive composition at 355 nm and 375 nm wavelengths is 1.2 to 1.8, and the absorbance at 405 nm wavelength is 0.6 or more when the dry coating film thickness before exposure is 25 μm. Background technique [0002] Solder resist (solder resist) is a functional coating material applied to printed circuit boards. It masks and protects parts other than the parts where electronic parts are mounted, and plays a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/00
Inventor 金哲镐孔炳善李珉成郑贤真
Owner KCC CORP CO LTD
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