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Mixed-mode coupling using a substrate inductive device

A technology of inductive devices and substrates, which is applied to the components of connecting devices, inductors, coupling devices, etc.

Inactive Publication Date: 2015-11-04
PULSE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, since the two aforementioned components that make up the impedance of the transformer are of the "distributed" type, they cannot be easily compensated by adding external components, such as by adding discrete capacitors and / or inductors

Method used

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  • Mixed-mode coupling using a substrate inductive device
  • Mixed-mode coupling using a substrate inductive device
  • Mixed-mode coupling using a substrate inductive device

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Embodiment Construction

[0030] As used herein, the terms "electrical component" and "electronic component" are used interchangeably and refer to a component adapted to provide some electrical and / or signal conditioning function, including but not limited to inductive reactors (" Choke coils"), transformers, filters, transistors, gap core rings, inductors (coupled or otherwise), capacitors, resistors, operational amplifiers, and diodes, whether individually or in combination as discrete components or integrated circuit.

[0031] As used herein, the term "permeance" refers to any number of materials commonly used to form inductive magnetic cores or similar components, including but not limited to various formulations made of ferrite.

[0032]As used herein, the term "signal conditioning" or "conditioning" should be understood to include, but not limited to, signal transformation, filtering and noise mitigation, signal separation, impedance control and correction, current limiting, capacitance control, ...

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Abstract

An improved low cost and highly consistent inductive apparatus. In one embodiment, the low cost and highly consistent inductive apparatus addresses concerns with so called conductive anodic filament (CAF) that occurs within these laminate structures. These conditions include high humidity, high bias voltage (i.e. a large voltage differential), high-moisture content, surface and resin ionic impurities, glass to resin bond weakness and exposure to high assembly temperatures that can occur, for example, during lead free solder bonding application. In a variant, mixed mode coupling techniques are utilized in order to extend the underlying operating bandwidth of the substrate inductive device. Methods of manufacturing and using the aforementioned substrate inductive devices are also disclosed.

Description

[0001] Priority and Related Applications [0002] This application claims priority benefit to commonly-owned U.S. Patent Application Serial No. 14 / 057,900 of the same title, filed October 18, 2013, which asserts priority to a patent filed on November 7, 2012, entitled "Lining Substrate Inductive Device Methods and Apparatus," commonly owned U.S. Provisional Patent Application No. 61 / 723,688, the contents of each of which are incorporated by reference in their entirety incorporated into this article. [0003] This application is also related to commonly owned and co-pending U.S. Patent Application Serial No. 13 / 797,530 of the same title, filed March 12, 2013, which claims the same Priority to titled US Provisional Patent Application No. 61 / 723,688, the contents of each of the foregoing are hereby incorporated by reference in their entirety. This application is also related to commonly owned and co-pending U.S. Patent Application Serial No. 11 / 985,156, filed November 13, 2007, ...

Claims

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Application Information

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IPC IPC(8): H01F27/24H01F27/28H01R13/66
CPCH01F17/0033H01F17/06H01F27/28H01F41/04H01F41/046H01F2017/002Y10T29/4902H01F5/00
Inventor T·迪恩M·萨布瑞M·格林H·阿贝德玛摩尔
Owner PULSE ELECTRONICS
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